초록 ▼

Adherent matrix layers such as post-etch and other post-process residues are removed from a substrate by exposing them to a vapor phase solvent to allow penetration of the vapor phase solvent into the adherent matrix layers and condensing the vapor phase solvent into the adherent matrix layers and r

Adherent matrix layers such as post-etch and other post-process residues are removed from a substrate by exposing them to a vapor phase solvent to allow penetration of the vapor phase solvent into the adherent matrix layers and condensing the vapor phase solvent into the adherent matrix layers and revaporized to promote fragmentation of the matrix and facilitate removal. Megasonic energy may be transmitted via a transmission member to the adherent matrix through the solvent condensed thereon to loosen fragments and particles. The substrate is typically rotated to improve contact between the megasonic energy transmission member and the condensed solvent and achieve more uniform cleaning. A co-solvent which is soluble in the vapor phase solvent may be added to enhance removal of specific adherent matrix materials. A plasma pretreatment may be employed to react with and modify the matrix in a way that improves subsequent penetration by the vapor phase solvent and fragmentation of the adherent matrix for more complete removal from the substrate.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of removing an adherent matrix from a substrate surface of a substrate, the method comprising:exposing the adherent matrix on the substrate to a plasma-activated gas which reacts with the adherent matrix;separating the substrate from the plasma-activated gas;ex

[ What is claimed is:] [1.]1. A method of removing an adherent matrix from a substrate surface of a substrate, the method comprising:exposing the adherent matrix on the substrate to a plasma-activated gas which reacts with the adherent matrix;separating the substrate from the plasma-activated gas;exposing the adherent matrix to a vapor phase solvent to allow penetration of the vapor phase solvent into the adherent matrix;condensing the vapor phase solvent after penetration of the vapor phase solvent into the adherent matrix to disrupt the adherent matrix to produce fragments; andremoving the fragments from the substrate surface.