초록 ▼

A semiconductor pressure sensor compatible with fluid and gaseous media applications is described. The semiconductor pressure sensor includes a sensor capsule having a semiconductor die and a silicon cap that is bonded to the semiconductor die. The semiconductor die includes a diaphragm that incorpo

A semiconductor pressure sensor compatible with fluid and gaseous media applications is described. The semiconductor pressure sensor includes a sensor capsule having a semiconductor die and a silicon cap that is bonded to the semiconductor die. The semiconductor die includes a diaphragm that incorporates piezoresistive sensors thereon, and a stress isolation mechanism for isolating the diaphragm from packaging and mounting stresses. The silicon cap includes a cavity for allowing the diaphragm to deflect. The semiconductor pressure sensor further includes a pressure port that is hermetically attached to the semiconductor die. The sensor capsule and pressure port may be incorporated into a plastic housing. In one embodiment, the silicon cap is bonded to the semiconductor die to form an integral pressure reference. In an alternative embodiment, a second pressure port is provided for allowing gage or differential pressure measurements. A technique for incorporating the piezoresistive sensors is also described. An ASIC may be optionally attached to the silicon cap, and/or active electronic circuitry may be fabricated on the semiconductor die or silicon cap. Additional coatings may be optionally applied to the pressure port and semiconductor die for enhancing chemical resistance.

대표청구항 ▼

[ What is claimed is:] [1.]1. A semiconductor pressure sensor, comprising:a sensor capsule includinga semiconductor die havinga diaphragm region to deflect responsive to applied pressure,a nominally rigid rim region to support the periphery of the diaphragm region,an outer frame region, anda stress

[ What is claimed is:] [1.]1. A semiconductor pressure sensor, comprising:a sensor capsule includinga semiconductor die havinga diaphragm region to deflect responsive to applied pressure,a nominally rigid rim region to support the periphery of the diaphragm region,an outer frame region, anda stress isolation region to couple the rim region to the outer frame region, anda silicon cap that is bonded to the outer frame region of the semiconductor die to cover the diaphragm region; anda pressure port hermetically attached to the sensor capsule.