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Thermal connection system for modular computer system components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0419867 (1999-10-19)
발명자 / 주소
  • Hoss Shawn P.
  • Moss David L.
출원인 / 주소
  • Dell USA, L.P.
대리인 / 주소
    Baker Botts L.L.P.
인용정보 피인용 횟수 : 22  인용 특허 : 21

초록

A method and system of thermally connecting internal components of a computer system to a heat sink. The components are arranged as modular units, each having at least one component heat conductor extending from it. For each component heat conductor, an arterial heat conductor extends from the heat

대표청구항

[ What is claimed is:] [1.]1. A thermal connection system for connecting integrated circuit components to a heat sink, the components and the heat sink being arranged substantially side by side in a housing, comprising:a number of component heat conductors, each having a heat input end and a heat ou

이 특허에 인용된 특허 (21)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
  2. Arii ; Hiroshi ; Kawada ; Hirohito ; Yoshida ; Takashi ; Nonaka ; Chiaki, Apparatus for cooling electrical components.
  3. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  4. Gandre Jerry ; Schmitt Ty, Combination heat sink and air duct for cooling processors with a series air flow.
  5. DiStefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA), Compliant thermal connectors and assemblies incorporating the same.
  6. Scholder Erica, Computer with an improved internal cooling system.
  7. Hileman Vince P., Electronic card with blind mate heat pipes.
  8. Oyamada Takashi,JPX, Electronic device having a plug-in unit with a heat sink structure.
  9. Smith Randall (Georgetown TX) Mills R. Steven (Austin TX), For use with a heatsink a shroud having a varying cross-sectional area.
  10. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  11. Jeffries John ; Wang Ray, Heat dissipator with multiple thermal cooling paths.
  12. Yamaji Hiroshi (Kawasaki JPX) Hongoh Tomoyuki (Kawasaki JPX) Sato Takashi (Kawasaki JPX) Takahashi Tsutomu (Kawasaki JPX) Magome Riichi (Kawasaki JPX), Heat pipe connector and electronic apparatus and radiating fins having such connector.
  13. Penniman Mark B. (Austin TX) Schlesener Carmen M. (Pflugerville TX) Kizer Jim J. (Austin TX), Heat pipe device and method for attaching same to a computer keyboard.
  14. Bhatia Rakesh ; Haley Kevin, Heat pipe exchanger system for cooling a hinged computing device.
  15. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  16. Hood ; III Charles D. ; Liu Peter, Heat sink assembly with rotating heat pipe.
  17. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit heat sink with rotatable heat pipe.
  18. Bhatia Rakesh, Power cable heat exchanger for a computing device.
  19. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  20. Mok Lawrence Shungwei, Rotational joint for hinged heat pipe cooling of a computer.
  21. Basiulis Algerd (Redondo Beach CA), Separate liquid flow heat pipe system.

이 특허를 인용한 특허 (22)

  1. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Cartridge type server unit and a cabinet to accommodate multiple said server units.
  2. Beck, Paul J.; Beck, Maxwell J., Cooling device for computer hard drive.
  3. Tsai,Kuo Ying; Ku,Shih Chang, Electronic apparatus and thermal dissipating module thereof.
  4. Wang,David G.; Muller,P. Keith, Heat sink for enhanced heat dissipation.
  5. El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Rubio, Juan C., Heatsink allowing in-situ maintenance in a stackable module.
  6. El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Rubio, Juan C., Heatsink allowing in-situ maintenance in a stackable module.
  7. El-Essawy, Wael R.; Keller, Jr., Thomas W.; Roy, Jarrod A.; Rubio, Juan C., Liquid cooling system for stackable modules in energy-efficient computing systems.
  8. El-Essawy, Wael R.; Keller, Thomas W; Roy, Jarrod A.; Rubio, Juan C., Liquid cooling system for stackable modules in energy-efficient computing systems.
  9. El-Essawy, Wael R; Keller, Thomas W; Roy, Jarrod A.; Rubio, Juan C., Liquid cooling system for stackable modules in energy-efficient computing systems.
  10. Sugahara, Hiroto, Liquid delivering apparatus and method of producing the same.
  11. Sugahara,Hiroto, Liquid delivering apparatus and method of producing the same.
  12. French,F. William; Merrill,Leonard A., Method and apparatus for dispersing heat from high-power electronic devices.
  13. Memory, Stephen B.; Ganaway, Fredrick E.; Rogers, C. James; DeVuono, Anthony C.; Phillips, Alfred; Zuo, Zhijun, Modular cooling system and thermal bus for high power electronics cabinets.
  14. Unrein, Edgar J., Partitioned computer platform.
  15. Facusse, Mario; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.
  16. Carter, John B.; El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Li, Jian; Rajamani, Karthick; Rubio, Juan C.; Speight, William E.; Zhang, Lixin, Scalable space-optimized and energy-efficient computing system.
  17. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Server unit comprising stacked multiple server unit cabinets accommodating multiple cartridge type server units.
  18. Carter, John B.; El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Felter, Wesley M.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Rajamani, Karthick; Rubio, Juan C.; Speight, William E.; Zhang, Lixin, Stackable module for energy-efficient computing systems.
  19. Pflueger,John C., Thermal docking station for electronics.
  20. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.
  21. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.
  22. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.
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