초록

A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.

대표청구항 ▼

[ We claim:] [1.]1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambien

[ We claim:] [1.]1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambient dew point;an insulated housing having its base attached to said printed circuit board substrate and surrounding the outer perimeter of said integrated circuit module so as to enclose said evaporator unit and said integrated circuit module;an enclosure surrounding said insulated housing, said enclosure having an atmosphere of dehumidified air maintained therein;an inlet conduit in communication with an interior of said enclosure;an exhaust outlet in communication with said interior of said enclosure; anda capillary tube wrapped around said inlet conduit said capillary tube having coolant circulating therethrough;wherein a flow of dehumidified air is introduced into said interior of said enclosure through said inlet conduit and said dehumidified air exits said enclosure through said exhaust outlet.