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Multilayer conductive polymer device and method of manufacturing same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01C-007/10
  • H01C-007/13
출원번호 US-0191921 (1998-11-13)
발명자 / 주소
  • Barrett Andrew Brian,IEX
  • Walsh Denis,IEX
출원인 / 주소
  • Bourns, Inc.
대리인 / 주소
    Klein & Szekeres, LLP
인용정보 피인용 횟수 : 17  인용 특허 : 91

초록

An electronic device includes two or more conductive polymer layers sandwiched between two external electrodes and one or more internal electrodes. A three layer device is manufactured by: (1) providing a first laminated substructure comprising a first polymer layer between first and second metal la

대표청구항

[ What is claimed is:] [1.]1. An electronic device, comprisingfirst, second and third parallel planar electrodes;a first conductive polymer layer between the first and second electrodes;a second conductive polymer layer between the second and third electrodes;a first minor metallized area coplanar w

이 특허에 인용된 특허 (91)

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이 특허를 인용한 특허 (17)

  1. Wood,Dustin P., Chip package with degassing holes.
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