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System and method for image subtraction for ball and bumped grid array inspection 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-009/00
  • H04N-007/18
  • G01N-021/00
출원번호 US-0134654 (1998-08-14)
발명자 / 주소
  • King Steven Joseph
  • Ludlow Jonathan Edmund
출원인 / 주소
  • Acuity Imaging, LLC
대리인 / 주소
    Bourque & Associates, P.A.
인용정보 피인용 횟수 : 20  인용 특허 : 45

초록

An inspection system and method uses a first illumination apparatus, such as a ring illumination apparatus to illuminate one or more reflective elements, such as solder balls on an electronic component or other protruding surfaces or objects. The ring illumination apparatus includes a substantially

대표청구항

[ What is claimed is:] [14.]14. A method of inspecting an article to highlight desired features while masking unwanted features, said method comprising the steps of:a. sequentially illuminating said article using first and second illumination apparatuses, said first and second illumination apparatus

이 특허에 인용된 특허 (45)

  1. Brown Mark D. (Carrollton TX) Kaiser Stephen B. (Flower Mound TX), Apparatus and method for inspection.
  2. Tokura Nobufumi (Fukuoka JPX) Nishi Shoichi (Fukuoka JPX), Apparatus for and method of detecting shape of solder portion.
  3. Radl Bruce M. (Stow MA) Lumia John J. (North Reading MA) Gold Bennett I. (Worcester MA), Apparatus for generating edge position signals for use in locating an address element on a mailpiece.
  4. Kobayashi Shigeki (Kyoto JPX) Tanimura Yasuaki (Kyoto JPX) Yotsuya Teruhisa (Kyoto JPX), Apparatus for inspecting printed circuit boards and the like, and method of operating same.
  5. LeBeau Christopher J. (Tempe AZ), Automatic package inspection method.
  6. Sugawara Kenji (Tokyo JPX), Bonding wire inspection apparatus and method.
  7. White Timothy P. (New Boston NH) Messina Michael C. (Goffstown NH) LeBlanc Steven M. (Hancock NH), Continuous diffuse illumination method and apparatus.
  8. Kalnajs Andrejs K. (Madison AL) Mueller Rolf H. (Auburn NY), Distributed light delivery system.
  9. Cochran Don W. (Mayfield Village OH) Austin James R. (Mentor-on-the-Lake OH), Engineered video inspecting lighting array.
  10. Anderson Charles H. (Dallas TX), Hemispherical non-glare illuminator.
  11. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), High speed illumination system for microelectronics inspection.
  12. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), High speed image acquisition for microelectronics inspection.
  13. White Timothy P. (New Boston NH), Illumination device for indirectly illuminating an object with continuous diffuse light.
  14. White Timothy P. (146 Lull Rd. New Boston NH 03070), Illumination device for providing continuous diffuse light on and off an observing axis.
  15. Arnold Aaron L. (Palm Beach Gardens FL 4) Woodward Daniel A. (West Palm Beach FL), Illumination devices for inspection systems.
  16. Borgert Gerald D. (Northville MI) Bartlett Robert J. (Ann Arbor MI) Ellison James F. (Brighton MI), Illumination system and method for generating an image of an object.
  17. Cochran Don W. (Highland Heights OH) Austin James R. (Mentor-on-the-Lake OH), Inspection lighting system.
  18. Yoshida Hajime (Tokyo JPX), Lighting device for inspecting objects for flaws.
  19. Koljonen Juha (Needham MA) Michael David J. (Newton MA), Method and apparatus for ball bond inspection system.
  20. Nagashima Hideyuki (Fujisawa JPX), Method and apparatus for detecting the position of defect in a hollow fiber membrane module.
  21. Beers Gregory E. (Austin TX) Bogaczyk Francis W. (Austin TX) Rubsam Michael A. (Austin TX) Wattenbarger Henry E. (Pflugerville TX), Method and apparatus for electronic component lead inspection.
  22. Ray Rajarshi (Princeton NJ), Method and apparatus for inspecting articles.
  23. Tokura Nobufumi (Fukuoka JPX), Method and apparatus for inspecting solder portions.
  24. Tokura Nobufumi (Fukuoka-ken JPX), Method and apparatus for inspecting solder portions.
  25. Takagi Yuji (Yokohama JPX) Hata Seiji (Fujisawa JPX), Method and apparatus for inspecting surface pattern of object.
  26. Reiser Kurt (Hawthorne CA), Method and apparatus for inspection of solder joints utilizing shape determination from shading.
  27. Ray Rajarshi (Princeton NJ), Method and apparatus for inspection of specular, three-dimensional features.
  28. Scott Richard S. F. (Woodside CA) Uziel Yoram (Yodfat CA ILX) Filice Franco A. (Gilroy CA), Method and apparatus for the automated analysis of three-dimensional objects.
  29. Smeyers Gust (Meise BEX) Vanderheydt Luc (Wilsele BEX), Method and device for determining a position of at least one lead of an electronic component.
  30. Breu Heinz (Mountain View CA), Method for inspecting the leads of electrical components on surface mount printed circuit boards.
  31. Kobayashi Shigeki (Shiga JPX) Takahara Hideaki (Kyoto JPX), Method of and apparatus for inspecting printed circuit boards and the like.
  32. Sharp Benny H. (Yukon OK), Method of and video system for identifying different light-reflective surface areas on articles.
  33. Rostoker Michael D. ; Schneider Mark R. ; Fulcher Edwin, Method of assembling ball bump grid array semiconductor packages.
  34. Collet-Beillon Olivier (27 Avenue de Brimont 78400-Chatou FRX), Method of inspecting an array of solder ball connections of an integrated circuit module.
  35. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), Microelectronics inspection system.
  36. Doan Tam D. (Orange CA), Optical inspection system for solder joints and inspection method.
  37. Barnes Ramon M. (Hadley MA) Bertenyi Istvan (Budapest HUX), Plasma spectroscopic analysis of organometallic compounds.
  38. Vodanovic Bojko (Beaconsfield CAX) Blanchard Michel (St-Hyacinthe CAX), QFP lead quality inspection system and method.
  39. Nichani Sanjay ; Scola Joseph, Semiconductor device image inspection utilizing image subtraction and threshold imaging.
  40. Nayar Shree K. (Pittsburgh PA) Sanderson Arthur C. (Williamstown MA) Weiss Lee E. (Pittsburgh PA) Simon David A. (Pittsburgh PA), Solder joint inspection system and method.
  41. Schoenbaum Gary L. (Newtown CT) Latanzi Lewis A. (Roxbury CT) Hedrick Stephen L. (Danbury CT) Johnson Harold V. (Danbury CT), Solder process inspection diffuser assembly.
  42. Okamoto Shinji (Yawata JPX) Yoshimura Kazunari (Yawata JPX) Nakahara Tomoharu (Nishinomiya JPX), Soldering inspection system and method therefor.
  43. Maali Ferevdoun (New York NY) Poch Leonard J. (Apalachin NY) Hickok George E. (Marathon NY), System and method for locating solder bumps on semiconductor chips or chip carriers.
  44. Amir Israel (Ewing NJ), Technique for illuminating a surface with a gradient intensity line of light to achieve enhanced two-dimensional imaging.
  45. Iwai Takao (Toyota JPX), Weld bead quality determining apparatus.

이 특허를 인용한 특허 (20)

  1. Aikawa, Tetsuro; Satoh, Yoshinori; Ochiai, Makoto; Adachi, Hiroyuki, Appearance inspection apparatus and appearance inspection method.
  2. Beaty,Elwin M.; Mork,David P., Electronic component products and method of manufacturing electronic component products.
  3. Beaty,Elwin M.; Mork,David P., Electronic component products made according to a process that includes a method for three dimensional inspection.
  4. Watanabe, Norio, Fabrication method of semiconductor integrated circuit device.
  5. Watanabe, Norio, Fabrication method of semiconductor integrated circuit device.
  6. Okada, Yasuichi; Yamasaki, Kimiyuki; Kihara, Masahiro, Image recognition apparatus and method for surface discrimination using reflected light.
  7. Smets,Carl; Van Gils,Karel; Zabolitsky,John; Everaerts,Jurgen, Method and an apparatus for measuring positions of contact elements of an electronic component.
  8. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  9. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  10. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  11. Lam,Kit S.; Lehman,Alan L., Method for determining differences in molecular interactions and for screening a combinatorial library.
  12. Koljonen, Juha, Method for locating features on an object using varied illumination.
  13. Ishii, Akira; Mitsudo, Jun, Method for measuring height of sphere or hemisphere.
  14. Beaty,Elwin M.; Mork,David P., Method of manufacturing electronic components including a method for three dimensional inspection.
  15. Winkler, Matthias; Koch, Michael, Placement apparatus and placement method.
  16. Ichikawa,Masayoshi; Kikuchi,Aritomo, Position detecting apparatus, a position detecting method and an electronic component carrying apparatus.
  17. Padgett, William Brandon; Kesler, Ralph Steven; Cameron, Michael E.; Horton, Roger D., System and a method for detecting fiber damage in a dialyzer.
  18. Bertin, Jeremy Georges; Singh, Rajesh Kumar; Hoffmann, Markus Ingo; Lumsden, Randolph William, System and method for inspecting components of hygienic articles.
  19. Jefferson,Stanley T., System and method for parallel image reconstruction of multiple depth layers of an object under inspection from radiographic images.
  20. Kim, Chang-Hyo; Choi, Tae-Sun, Three-dimensional soldering inspection apparatus and method.
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