$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

High density printed circuit substrate and method of fabrication 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/00
출원번호 US-0123952 (1998-07-28)
발명자 / 주소
  • Pommer Richard J.
  • Gotro Jeffrey T.
  • Androff Nancy M. W.
  • Hein Marc D.
  • Zarecki Corey J.
출원인 / 주소
  • Isola Laminate Systems Corp.
대리인 / 주소
    McDonnell Boehnen Hulbert & Berghoff
인용정보 피인용 횟수 : 25  인용 특허 : 18

초록 ▼

The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric laye

대표청구항 ▼

[ What is claimed is:] [1.]1. An electrical substrate comprising:a dielectric layer having a surface roughness of no greater than 6.0 microns; anda first conductive layer attached to said dielectric layer wherein the conductive layer is applied to at least a portion of the dielectric layer surface t

이 특허에 인용된 특허 (18)

  1. Young Steven J. (Milpitas CA), Battery cell having an internal circuit for controlling its operation.
    상세보기
  2. Kozuka Shoji (Kawasaki JPX) Hayashi Masaru (Yokohama JPX) Oh-Ishi Katsuyoshi (Kawasaki JPX) Yasumoto Takaaki (Kawasaki JPX) Iwase Nobuo (Kamakura JPX) Endo Hiroshi (Yokohama JPX) Yamakawa Koji (Kawas, Ceramic circuit board having a thermal conductivity substrate.
    상세보기
  3. Sallo Jerome S. (Northridge CA), Copper-chromium-polyimide composite.
    상세보기
  4. Tagusari Hideyasu,JPX ; Hirasawa Yutaka,JPX ; Oshima Kazuhide,JPX, Electrodeposited copper foil for printed wiring board and method for manufacturing the same.
    상세보기
  5. Katagiri Mikio (Tokyo JPX) Kato Tatsuo (Yamaguchi JPX), Matt film with a rough surface.
    상세보기
  6. Ishii Kenji (Tokyo JPX) Nakai Takamasa (Tokyo JPX) Matsumoto Hiroyuki (Tokyo JPX), Metal foil-clad laminate having surface smoothness.
    상세보기
  7. Blackwell Kim J. (Owego NY) Chen Pei C. (Endicott NY) Deliman Stephen E. (Endicott NY) Knoll Allan R. (Endicott NY) Matarese George J. (Bradenton FL) Weale Richard D. (Owego NY), Method for metallizing through holes in thin film substrates, and resulting devices.
    상세보기
  8. Blackwell Kim J. (Owego NY) Chen Pei C. (Endicott NY) Deliman Stephen E. (Endicott NY) Knoll Allan R. (Endicott NY) Matarese George J. (Bradenton FL) Weale Richard D. (Owego NY), Method for metallizing through holes in thin film substrates, and resulting devices.
    상세보기
  9. Clarke Thomas C. (Morgan Hill CA) Kovac Caroline A. (Ridgefield CT) Jung Dae Y. (Endwell NY) Park Jae M. (Mahopac NY) Thomas Richard R. (Fishkill NY), Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless met.
    상세보기
  10. Brown Lawrence E. (Loveland CO) Bauer James L. (Loveland CO) Scheck Gerald W. (Loveland CO), Method for producing a metallic pattern upon a substrate.
    상세보기
  11. Sakai Hiroshi,JPX ; Nakamura Yoshihiro,JPX ; Murai Hikari,JPX ; Iijima Toshiyuki,JPX, Method of producing metal clad laminate.
    상세보기
  12. Topp Rainer (Reutlingen DEX) Uebele Manfred (Reutlingen DEX), Monolithically integrated MOS output-stage component with overload-protection means.
    상세보기
  13. Bahrle Dieter (Schnaich DEX) Schwerdt Friedrich (Herrenberg DEX) Stehling Jurgen H. (Herrenberg DEX), Process for producing printed circuits.
    상세보기
  14. Arrington Edward Lee ; Camp John Christopher ; Day Robert Jeffrey ; Fey Edmond Otto ; Gunther Curtis Michael ; Miller Thomas Richard, Process for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrate.
    상세보기
  15. Kumagai Koichi (Ikoma JPX), Resin circuit substrate and manufacturing method therefor.
    상세보기
  16. Kasai Shin (Fukushima JPX) Waketa Hideharu (Fukushima JPX) Kato Keiichi (Fukushima JPX) Kawaguchi Yutaka (Fukushima JPX), Substrate for printed circuit.
    상세보기
  17. Shigemoto Hiromi (Iwakuni JPX) Abe Shunji (Tokyo JPX) Yamamoto Akio (Iwakuni JPX), Surface-roughened film and sheet, and process for production and use thereof.
    상세보기
  18. Kasai Shin (Fukushima JPX) Waketa Hideharu (Fukushima JPX) Kato Keiichi (Fukushima JPX) Kawaguchi Yutaka (Fukushima JPX), Woven material of inorganic fiber and process for making the same.
    상세보기

이 특허를 인용한 특허 (25)

  1. McDermott, Brian J.; McGowan, Daniel; Spotts, Jr., Ralph Leo; Tryzbiak, Sid, Circuit board or other multilayer electrical device made by forming teeth to join layers.
    상세보기
  2. Pachla, Timothy; Harris, Edwin James; Vyas, Tushar, Direct application voltage variable material.
    상세보기
  3. Harris,Edwin James; Vyas,Tushar; Whitney,Stephen J., Direct application voltage variable material, components thereof and devices employing same.
    상세보기
  4. Harris,Edwin James; Vyas,Tushar; Pachla,Timothy; Colby,James A., Direct application voltage variable material, devices employing same and methods of manufacturing such devices.
    상세보기
  5. Kojima,Toshifumi; Wakazono,Makoto; Takada,Toshikatu, Filling material, multilayer wiring board, and process of producing multilayer wiring board.
    상세보기
  6. Kataoka,Tatsuo; Akashi,Yoshikazu, Film carrier tape for mounting electronic devices thereon.
    상세보기
  7. Chiu, Chien-Hwa; Chao, Chih-Min; Kuo, Peir-Rong; Chiang, Chia-Hua; Hsiao, Chih-Cheng; Kuan, Feng-Ping; Lee, Ying-Wei; Juang, Yung-Chang, Flexible circuit board and process for producing the same.
    상세보기
  8. Harris, Edwin James; Pachla, Timothy; Vyas, Tushar, Flexible circuit having overvoltage protection.
    상세보기
  9. Moriizumi, Kiyokazu, Front-and-back electrically conductive substrate.
    상세보기
  10. Harkness, Jr., Arthur E.; Kenny-McDermott, Eva M.; Farineau, Paul W.; Lavallee, Raymond A.; Fancher, Michael, High-speed interconnects for printed circuit boards.
    상세보기
  11. Kim, Nam-Jin; Ahn, Young-Cheol; Kim, Won-Jae, Method for fabricating printed circuit board.
    상세보기
  12. Moriizumi,Kiyokazu, Method for making a front and back conductive substrate.
    상세보기
  13. Wunderlich, Christian; Backus, Petra; Mahlkow, Hartmut, Method for producing solderable and functional surfaces on circuit carriers.
    상세보기
  14. Rendek, Jr., Louis Joseph; Weatherspoon, Michael Raymond; Rodriguez, Casey Philip; Nicol, David, Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices.
    상세보기
  15. Rendek, Jr., Louis Joseph; Weatherspoon, Michael; Rodriguez, Casey Philip; Nicol, David, Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices.
    상세보기
  16. Sidhu, Rajwant; Walker, Paul, Method of manufacturing a printed circuit board.
    상세보기
  17. Leif Bergstedt SE; Per Ligander SE, PCB and method for making PCB with thin copper layer.
    상세보기
  18. Japp, Robert M.; Poliks, Mark D., Porous power and ground planes for reduced PCB delamination and better reliability.
    상세보기
  19. Koizumi,Nobukazu, Printed wiring board manufacturing method.
    상세보기
  20. Day, Richard Allen; Knadle, Kevin Taylor; Stauffer, Kristen Ann, Selectively roughening conductors for high frequency printed wiring boards.
    상세보기
  21. Day,Richard Allen; Knadle,Kevin Taylor; Stauffer,Kristen Ann, Selectively roughening conductors for high frequency printed wiring boards.
    상세보기
  22. Burrell, Lloyd G.; Wong, Kwong H.; Kelly, Adreanne A.; McKnight, Samuel R., Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad.
    상세보기
  23. Harris,Edwin James; Davidson,Scott; Perry,David; Whitney,Steven J., Voltage variable material for direct application and devices employing same.
    상세보기
  24. Harris, IV,Edwin James, Voltage variable substrate material.
    상세보기
  25. Kaneda,Yutaka, Wiring circuit board having bumps and method of producing same.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로