초록

A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module mounted on a printed circuit board is enclosed within an insulated housing, and the area of the printed circuit board adjacent the cooled IC module is encapsulated in an insulated jacket.

대표청구항 ▼

[ We claim:] [1.]1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambien

[ We claim:] [1.]1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambient dew point;an insulated housing having its base attached to said printed circuit board substrate and surrounding the outer perimeter of said integrated circuit module so as to enclose said evaporator unit and said integrated circuit module; and,an insulated jacket encapsulating an area of the printed circuit board adjacent the area where the insulated housing is attached to the printed circuit board, said insulated jacket further encapsulating both the top side and bottom side of the printed circuit board.