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Heatsink with integrated blower for improved heat transfer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0425639 (1999-10-22)
발명자 / 주소
  • Budelman Gerald A.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 49  인용 특허 : 23

초록

A device that efficiently transfers heat from a heat source. The device includes a heat sink, the heat sink comprising a thermally conductive base, and a plurality of thermally conductive pin fins coupled to the thermally conductive base. A gas source, such as a blower, proximate to the pin fins, di

대표청구항

[ What is claimed is:] [1.]1. An apparatus comprising:a thermally conductive base;a plurality of thermally conductive pins coupled to the thermally conductive base; anda blower having a circular face element and vanes disposed about the perimeter of the face element, the face element and vanes encom

이 특허에 인용된 특허 (23)

  1. Jacoby John H. (Providence RI), Airflow directional vane for a heatsink.
  2. Chuang Wen-Hao,TWX, Bushing for combining fan and heat sink.
  3. Chiou Ming Horng,TWX, CPU heat sink fastener.
  4. Daikoku Takahiro,JPX ; Tsubaki Shigeyasu,JPX, Cooling apparatus for electronic devices.
  5. Kodaira Yuichi,JPX ; Kodama Nobumasa,JPX ; Ogawara Toshiki,JPX, Cooling apparatus for electronic element.
  6. Batchelder John Samual, Fluid transmissive apparatus for heat transfer.
  7. Kenny Gary R. ; Smith Dean Leonard ; Kerr Roger Stanley, Heat exchanger.
  8. Kogure Eiji,JPX ; Fukushima Tadashi,JPX ; Tsukahara Hiroaki,JPX ; Imai Toshihisa,JPX ; Oshima Takao,JPX ; Kaga Kunihiko,JPX, Heat radiating plate.
  9. Lorenzetti Victor (Dedham MA) Pontes Manuel (Somerville MA), Heat sink.
  10. Hong Chen F. (No. 3 ; Lane 45 ; Yi-Yung Road Kaohsiung TWX), Heat sink assembly for the central processor of computer.
  11. Katsui Tadashi,JPX ; Nakata Katsuhiko,JPX ; Koga Takeshi,JPX ; Matsumura Tadanobu,JPX ; Tanaka Yoshimi,JPX ; Sugimoto Yasuaki,JPX ; Kitahara Takashi,JPX ; Horinishi Takayuki,JPX, Heat sink for cooling a heat producing element and application.
  12. Katsui Tadashi (Kawasaki JPX), Heat sink having air movement device positioned among tins and between heating elements.
  13. Karabatsos Chris (42 Jumping Brook La. Kingston NY 12401) Smith Gary W. (12376 Darkwood Rd. San Diego CA 92129), Heat sink header assembly.
  14. Kikuchi Shunichi,JPX ; Hirano Minoru,JPX ; Seyama Kiyotaka,JPX ; Yoshimura Hideaki,JPX ; Kanda Takashi,JPX ; Nori Hitoshi,JPX, Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure.
  15. Feenstra Sean D., Heat sink utilizing the chimney effect.
  16. Kitahara Takashi,JPX ; Shimanuki Tadayoshi,JPX, Heat-generating element cooling device.
  17. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  18. Barker ; III Charles R. (Harvard MA) Olson Richard E. (Boylston MA) Lindquist Stephen E. (Boylston MA) Hartsarich Massimo (Kunzelsau DEX) Cease David A. (Avon CT) Sobolewski Robert S. (Woodbury CT), High performance fan heatsink assembly.
  19. Mira Ali (San Jose CA), High performance spiral heat sink.
  20. Nelson Daryl J. (Beaverton OR) Tirumala Muralidhar (Portland OR) Butler Peter (Hillsboro OR) Budelman Gerald A. (Aloha OR), Integrated circuit package with an integral heat sink and fan.
  21. Hinshaw Howard G. (Dallas TX), Method of manufacturing heat sink apparatus.
  22. Liu Yen-Wen,TWX, Modularized electronic component cooling apparatus.
  23. Harrington Steven S. (5158 Clareton Agoura Hills CA 91301), Thermoelectric air cooling device.

이 특허를 인용한 특허 (49)

  1. Armstrong, Ross, Active heat sink.
  2. Joseph M White, Active heat sink structure with directed air flow.
  3. White, Joseph M., Active heat sink structure with directed air flow.
  4. Kaslusky, Scott F.; St. Rock, Brian; Lee, Jaeseon; Jiang, Yirong, Active structures for heat exchanger.
  5. Kamath, Vinod; Loebach, Beth Frayne; Matteson, Jason Aaron; Mansuria, Mohanlal S., Apparatus having forced fluid cooling and pin-fin heat sink.
  6. O'Connor, Jr.,John F., Centrifugal impeller.
  7. Lopatinsky, Edward; Schaefer, Daniel; Rosenfeld, Saveliy; Fedoseyev, Lev, Cooler for an electronic device.
  8. Lopatinsky, Edward; Fedoseyev, Lev A.; Fedosov, Yuriy Igorevich; Askhatov, Nil, Cooler for electronic devices.
  9. Lopatinsky,Edward L.; Schaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Cooler for electronic devices.
  10. Wysk, Hans-Joachim; Glatz, Karl-Heinz, Cooling apparatus for an electronic device to be cooled.
  11. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E.; Singh,Prabjit, Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins.
  12. Koga,Shinya; Matsuda,Toshihiko; Niwatsukino,Kyo; Sakai,Toshisuke; Kubota,Toshiyuki; Hirose,Masashi; Narakino,Shigeru; Aizono,Yoshimitsu; Kasahara,Kazuyuki, Cooling device and an electronic apparatus including the same.
  13. Niwatsukino, Kyo; Hirose, Masashi; Narakino, Shigeru; Aizono, Yoshimitsu; Kasahara, Kazuyuki; Koga, Shinya; Sakai, Toshisuke; Kubota, Toshiyuki, Cooling device and an electronic apparatus including the same.
  14. Sugitani, Choei; Mikami, Kazuaki, Display device.
  15. Carter,Daniel P.; Crocker,Michael T., Electronic assemblies with high capacity bent fin heat sinks.
  16. Carter, Daniel P.; Crocker, Michael T.; Broili, Ben M.; Byquist, Tod A.; Llapitan, David J., Electronic assemblies with high capacity curved fin heat sinks.
  17. Carter,Daniel P.; Crocker,Michael T.; Broili,Ben M.; Byquist,Tod A.; Llapitan,David J., Electronic assemblies with high capacity heat sinks and methods of manufacture.
  18. Feismann, Timo; Rieke, Matthias, Electronic device for a motor vehicle.
  19. Garcia, Philip, Heat dissipating system and method.
  20. Huang, Wen-Shi; Chang, Bor Haw; Huang, Yu-Hung, Heat dissipation device with high efficiency.
  21. McLaughlin, Robyn Rebecca Reed; Stellman, Jeffrey Taylor; Hill, Andrew; Bornemann, Paul, Heat dissipation in electronics.
  22. Khanna, Vijayeshwar D.; McVicker, Gerard; Sri-Jayantha, Sri M., Heat transfer device in a rotating structure.
  23. Kaslusky, Scott F.; St. Rock, Brian; Whiton, John H.; Nardone, Vincent C., Heat transfer device with fins defining air flow channels.
  24. Lee, Seri, High performance heat sink configurations for use in high density packaging applications.
  25. Lee, Seri, High performance heat sink configurations for use in high density packaging applications.
  26. Dugas, Roger, Inside-out heat sink.
  27. Dugas, Roger, Inside-out heat sink.
  28. Dugas, Roger, Inside-out heat sink.
  29. Gao, Ziyang; Lv, Ya; Tsui, Yat Kit, Locally enhanced direct liquid cooling system for high power applications.
  30. Wiley, Robert, Low profile equipment housing with angular fan.
  31. Wiley, Robert, Low profile equipment housing with angular fan.
  32. Birtcher,Charles Michael; Dunning,Richard J.; Clark,Robert Daniel; Hochberg,Arthur Kenneth; Steidl,Thomas Andrew, Method and vessel for the delivery of precursor materials.
  33. Tuominen, Marko; Shero, Eric; Verghese, Mohith, Method for controlling the sublimation of reactants.
  34. Jan Snijders, Gert; Raaijmakers, Ivo, Method for vaporizing non-gaseous precursor in a fluidized bed.
  35. Vanderwees, Doug, Mounting bracket for heat exchanger core face.
  36. St. Rock, Brian; Kaslusky, Scott F., Non-circular radial heat sink.
  37. Wang, Chin Wen; Wang, Pei Choa; Wang, Ching Chung, Planar heat pipe structure.
  38. Crocker, Michael T.; Carter, Daniel P.; Byquist, Tod A.; Broili, Ben M., Radial folded fin heat sinks and methods of making and using same.
  39. Sharfi, Benjamin K., Sealed integrated low profile cooling array.
  40. Salapakkam, Pradeep Chandra Babu; Li, Ri; Arik, Mehmet; Gerstler, William Dwight; Whalen, Bryan Patrick, Shaped heat sinks to optimize flow.
  41. Birtcher, Charles Michael; Steidl, Thomas Andrew, Solid source container with inlet plenum.
  42. Ichigaya, Hiroshi, Spacer for cooling devices.
  43. Freedman,Philip D., Structure with heat dissipating device and method.
  44. Dale, James L., Stud welded pin fin heat sink.
  45. Tuominen, Marko; Shero, Eric; Verghese, Mohith, System for controlling the sublimation of reactants.
  46. Tuominen, Marko; Shero, Eric; Verghese, Mohith, System for controlling the sublimation of reactants.
  47. Bunker, Ronald S.; Itzel, Gary Michael, Turbine bucket tip cap.
  48. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
  49. Herbert, Edward, Venturi fan.
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