초록 ▼

Resins which are a combination of phenolic and polyamide polymers are used as dipping resins to coat composite honeycomb structures. The phenolic/polyamide dipping resins increase the heat formability of composite honeycomb structures. The dip resin forms a coating on the honeycomb which includes fr

Resins which are a combination of phenolic and polyamide polymers are used as dipping resins to coat composite honeycomb structures. The phenolic/polyamide dipping resins increase the heat formability of composite honeycomb structures. The dip resin forms a coating on the honeycomb which includes from 30 to 95 weight percent phenolic resin and 5 to 30 weight percent polyamide resin. The dip resin is especially useful for coating composite honeycomb cores made from graphite or glass fibers impregnated with flexible phenolic resins.

대표청구항 ▼

[ What is claimed is:] [1.]1. In a honeycomb structure comprising a honeycomb core having walls comprising core fibers and core resin, said walls having a surface on which is coated a dip resin comprising phenolic resin, wherein the improvement comprises adding polyamide resin to said dip resin in a

[ What is claimed is:] [1.]1. In a honeycomb structure comprising a honeycomb core having walls comprising core fibers and core resin, said walls having a surface on which is coated a dip resin comprising phenolic resin, wherein the improvement comprises adding polyamide resin to said dip resin in an amount sufficient to increase the heat formability of said honeycomb structure.