초록

A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing and attached to a printed circuit board through an interconnect including a heating element embedded therein.

대표청구항 ▼

[ We claim:] [1.]1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambien

[ We claim:] [1.]1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambient dew point;an insulated housing having its base attached to said printed circuit board substrates said base surrounding the outer perimeter of said integrated circuit module so as to enclose said evaporator unit and said integrated circuit module; andan interconnect layer interposed between and electrically coupling the integrated circuit chip module and the printed circuit board substrate through a pattern of contact connections on the chip module and electrically conducting pads on said interconnect layer, said interconnect layer including a heating element embedded therein between said module and said substrate.