초록 ▼

A package for mounting an integrated circuit chip includes a body having at least a first region, the size of the integrated circuit chip, and a second region. The first region has a first coefficient of thermal expansion (CTE), and the second region has a second, different CTE. The first region app

A package for mounting an integrated circuit chip includes a body having at least a first region, the size of the integrated circuit chip, and a second region. The first region has a first coefficient of thermal expansion (CTE), and the second region has a second, different CTE. The first region approximately matches the CTE of the integrated circuit chip mounted on the package, and the second region approximates the CTE of the printed wiring board to which the package is mounted.

대표청구항 ▼

[ What is claimed is:] [1.]1. The combination of a microchip and a substrate, said microchip having a coefficient of thermal expansion, said microchip having an area, said microchip being mounted on said substrate, said combination comprising:a die area defined on the substrate, said die area substa

[ What is claimed is:] [1.]1. The combination of a microchip and a substrate, said microchip having a coefficient of thermal expansion, said microchip having an area, said microchip being mounted on said substrate, said combination comprising:a die area defined on the substrate, said die area substantially equal to the area of the microchip, wherein only said die area portion of the substrate has a coefficient of thermal expansion that approaches the coefficient of thermal expansion of the microchip to reduce relative movement between the microchip and the die area of the substrate through mismatched coefficients of thermal expansion of the microchip and of the die area.