초록 ▼

Disclosed is an automatic semiconductor wafer applying apparatus capable of lightly easily stacking and loading ring frames onto a frame supply section. This apparatus has the following construction. An adhesive tape unwound from a tape roll is applied to a lower surface of the ring frame supplied t

Disclosed is an automatic semiconductor wafer applying apparatus capable of lightly easily stacking and loading ring frames onto a frame supply section. This apparatus has the following construction. An adhesive tape unwound from a tape roll is applied to a lower surface of the ring frame supplied to a tape applying position. The applied adhesive tape is cut out along the ring frame. The ring frame having the adhesive tape applied thereto is transported to a wafer applying position. A semiconductor wafer is applied onto the adhesive tape of the ring frame. In this apparatus, a frame supply truck movable with the ring frames stacked and held thereon is arranged so that it can be pushed/transported into and pulled out/transported from the frame supply section. A lift unit for receiving, lifting and supplying a group of ring frames stacked on the pushed and transported frame supply truck is installed in the frame supply section.

대표청구항 ▼

[ What is claimed is:] [1.]1. An automatic semiconductor wafer applying apparatus for applying a semiconductor wafer to a ring frame through an adhesive tape, said apparatus comprising:a frame supply truck movable with ring frames stacked and held thereon;a frame supply section having a bay sized an

[ What is claimed is:] [1.]1. An automatic semiconductor wafer applying apparatus for applying a semiconductor wafer to a ring frame through an adhesive tape, said apparatus comprising:a frame supply truck movable with ring frames stacked and held thereon;a frame supply section having a bay sized and adapted to enable said frame supply truck to be pushed and transported into the bay and to be pulled out and transported from the bay;a lift unit disposed at least partially in the bay of said frame supply section for receiving, lifting and supplying a group of ring frames stacked on said frame supply truck pushed and transported into the bay of said frame supply section;a frame supply transport mechanism for supplying the ring frames lifted and supplied by said lift unit to a predetermined tape applying position;a tape applying mechanism for applying the adhesive tape unwound from a tape roll to a lower surface of the ring frame;a tape cutting mechanism for cutting out the applied adhesive tape along the ring frame;residual tape recovery means for winding up and recovering residual tape peeled from the lower surface of the ring frame;transport means for transporting the ring frame having the adhesive tape applied thereto to a predetermined wafer applying position;wafer applying means for transporting and applying the semiconductor wafer onto the adhesive tape of the ring frame set to said wafer applying position; anda frame storage section for storing the ring frame having the semiconductor wafer applied thereto.