초록 ▼

A substrate holder 90 where a thin film has accumulated on the surface of the holding claws 91 is transferred in a state where no substrate 9 is being held into a film removal chamber 70 which is established branching off in such a way that the vacuum is connected from the square transfer path 80 al

A substrate holder 90 where a thin film has accumulated on the surface of the holding claws 91 is transferred in a state where no substrate 9 is being held into a film removal chamber 70 which is established branching off in such a way that the vacuum is connected from the square transfer path 80 along which a plurality of vacuum chambers including the film deposition chambers 51, 52, 53, 54 and 50 is established. A high frequency power supply 73 is connected via the movable electrode 74 to the holder body 92 and a high frequency electric field is established within the film removal chamber 70. A plasma is formed by generating a high frequency discharge in the gas which is being delivered by means of the gas delivery system 72 and the accumulated film on the surface of the holding claws 91 is removed in a vacuum by sputter etching due to ion impacts.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of removing accumulated film from a surface of a substrate holder in a film deposition apparatus in which apparatus a prescribed thin film is formed on a substrate while the substrate is being held by the substrate holder in a film deposition chamber which is b

[ What is claimed is:] [1.]1. A method of removing accumulated film from a surface of a substrate holder in a film deposition apparatus in which apparatus a prescribed thin film is formed on a substrate while the substrate is being held by the substrate holder in a film deposition chamber which is being maintained in a vacuum, comprising the steps of:moving the substrate holder from the film deposition chamber to another vacuum chamber which is connected in an airtight manner to the film deposition chamber, without exposing the substrate holder to atmosphere; andremoving the accumulated film from the surface of the substrate holder under vacuum, wherein the removal is carried out when no substrate is being held in the substrate holder.