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Apparatus for forming an electrical contact with a semiconductor substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-017/00
출원번호 US-0283024 (1999-03-30)
발명자 / 주소
  • Talieh Homayoun
  • Basol Bulent
출원인 / 주소
  • Nutool, Inc.
대리인 / 주소
    Pillsbury Winthrop LLP
인용정보 피인용 횟수 : 73  인용 특허 : 7

초록 ▼

The present invention is directed to an apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stored in a reservoir and pump through an inlet

대표청구항 ▼

[ We claim:] [1.]1. A semiconductor workpiece plating apparatus for plating a front surface portion of a semiconductor workpiece, comprising:a workpiece support adapted to support the semiconductor workpiece such that the front surface portion is disposed to allow plating of a conductor within an el

이 특허에 인용된 특허 (7)

  1. Newman Aubrey W. (416 E. 45th St. Odessa TX 79762) Coffey J. E. (4018 Lakeside Dr. Odessa TX 79762) Whitney Arthur D. (807 New Castle Ct. Odessa TX 79762), Apparatus for plating journals of crankshafts.
    상세보기
  2. Okuyama Takeshi,JPX ; Watanabe Kouji,JPX ; Chiyonobu Tatsuo,JPX ; Hashimoto Kaoru,JPX ; Kawano Kyoichiro,JPX, Connector employing liquid conductor for electrical contact.
    상세보기
  3. Dubin Valery, Electroplating apparatus.
    상세보기
  4. Crafts Douglas E. ; Swain Steven M. ; Takahashi Kenji,JPX ; Ishida Hirofumi,JPX, Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interc.
    상세보기
  5. Ishida Hirofumi (Hiratsuka JPX), Plating device for wafer.
    상세보기
  6. Ishida Hirofumi (Kanagawa JPX), Plating device for wafer.
    상세보기
  7. Uzoh Cyprian Emeka, Wafer edge deplater for chemical mechanical polishing of substrates.
    상세보기

이 특허를 인용한 특허 (73)

  1. Sun,Lizhong; Tsai,Stan; Redeker,Fritz, Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus.
    상세보기
  2. Kelly, John; van den Hoek, Wilbert G. H.; Drewery, John S., Apparatus for electrically planarizing semiconductor wafers.
    상세보기
  3. Talieh,Homayoun, Apparatus for electroprocessing a workpiece surface.
    상세보기
  4. Ashjaee,Jalal; Nagorski,Boguslaw; Basol,Bulent M.; Talieh,Homayoun; Uzoh,Cyprian, Apparatus for processing surface of workpiece with small electrodes and surface contacts.
    상세보기
  5. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
    상세보기
  6. Li,Shijian; Chen,Llang Yuh; Duboust,Alain, Articles for polishing semiconductor substrates.
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  7. Mavliev,Rashid A.; Wadensweiler,Ralph M., Conductive pad.
    상세보기
  8. Mavliev, Rashid A.; Karuppiah, Lakshmanan, Conductive pad design modification for better wafer-pad contact.
    상세보기
  9. Chen,Liang Yun; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid A.; Tsai,Stan D.; Wang,You; Diao,Jie; Jia,Renhe; Karuppiah,Lakshmanan; Ewald,Robert, Conductive pad with ion exchange membrane for electrochemical mechanical polishing.
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  10. Butterfield, Paul D.; Chen, Liang-Yuh; Hu, Yonqi; Manens, Antoine P.; Mavliev, Rashid; Tsai, Stan D.; Liu, Feng Q.; Wadensweiler, Ralph; Sun, Lizhong; Neo, Siew S.; Duboust, Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  11. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph, Conductive polishing article for electrochemical mechanical polishing.
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  12. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
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  13. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  14. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
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  15. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
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  16. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
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  17. Hu, Yongqi; Wang, Yan; Duboust, Alain; Liu, Feng Q.; Mavliev, Rashid; Chen, Liang-Yuh; Morad, Ratson; Somekh, Sasson, Conductive polishing article for electrochemical mechanical polishing.
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  18. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  19. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  20. Liu, Feng Q.; Mavliev, Rashid, Contact assembly and method for electrochemical mechanical processing.
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  21. Kovarsky,Nicolay; Yang,Michael; Lubomirsky,Dmitry, Contact plating apparatus.
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  22. Herchen,Harald, Contact ring with embedded flexible contacts.
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  23. Butterfield, Paul; Chen, Liang Yuh; Hu, Yongqi; Manens, Antoine; Mavliev, Rashid; Tsai, Stan, Contacts for electrochemical processing.
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  24. Butterfield,Paul; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine; Mavliev,Rashid; Tsai,Stan, Contacts for electrochemical processing.
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  25. Mavliev,Rashid; Tsai,Stan; Hu,Yongqi; Butterfield,Paul; Manens,Antoine; Chen,Liang Yuh, Contacts for electrochemical processing.
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  26. Nagai, Mizuki; Okuyama, Shuichi; Kimizuka, Ryoichi; Kobayashi, Takeshi, Copper-plating liquid, plating method and plating apparatus.
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  27. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.
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  28. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.
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  29. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.
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  30. Duboust,Alain; Manens,Antoine P.; Chen,Liang Yuh, Edge bead removal by an electro polishing process.
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  31. Herchen,Harald; Lubomirsky,Dmitry; Zheng,Bo; Pang,Lily L., Electric field reducing thrust plate.
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  32. Basol, Bulent M.; Bogart, Jeffrey, Electrode and pad assembly for processing conductive layers.
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  33. Basol, Bulent M.; Talieh, Homayoun, Electropolishing system and process.
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  37. Burkhart,Vincent E.; Herchen,Harald; Yahalom,Joseph, Liquid isolation of contact rings.
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  39. Kholodenko, Arnold, Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process.
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  40. Duboust, Alain; Chang, Shou-Sung; Chen, Liang-Yuh; Wang, Yan; Neo, Siew; Sun, Lizhong; Liu, Feng Q., Method and apparatus for face-up substrate polishing.
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  41. Talieh,Homayoun; Basol,Bulent, Method and apparatus for forming an electrical contact with a semiconductor substrate.
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  42. Basol,Bulent M., Method and apparatus for localized material removal by electrochemical polishing.
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  43. Chadda,Saket, Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface.
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  44. Mayer, Steven T.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation.
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