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Dual-damascene dielectric structures and methods for making the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/476.3
출원번호 US-0346156 (1999-06-30)
발명자 / 주소
  • Uglow Jay E.
  • Bright Nicolas J.
  • Hemker Dave J.
  • MacWilliams Kenneth P.
  • Benzing Jeffrey C.
  • Archer Timothy M.
출원인 / 주소
  • Novellus Systems, Inc.
대리인 / 주소
    Martine Penilla & Kim, LLP
인용정보 피인용 횟수 : 55  인용 특허 : 6

초록

A dielectric structure and method for making a dielectric structure for dual-damascene applications over a substrate are provided. The method includes forming a barrier layer over the substrate, forming an inorganic dielectric layer over the barrier layer, and forming a low dielectric constant layer

대표청구항

[ What is claimed is:] [1.]1. A method of making a dielectric layer for use in dual-damascene applications, comprising:providing a substrate;depositing a barrier layer over the substrate; anddepositing a dopant varying oxide layer over the barrier layer, the depositing of the dopant varying oxide la

이 특허에 인용된 특허 (6)

  1. Avanzino Steven ; Gupta Subhash ; Klein Rich ; Luning Scott D. ; Lin Ming-Ren, Dual damascene with a sacrificial via fill.
  2. Nguyen Tue ; Hsu Sheng Teng, Low resistance contact between integrated circuit metal levels and method for same.
  3. Park Chang-soo,KRX, Metal wiring layer forming method for semiconductor device.
  4. Ting Chiu ; Dubin Valery, Plated copper interconnect structure.
  5. Jain Ajay, Process for forming a semiconductor device.
  6. Huang Richard J. (Milpitas CA) Hui Angela (Milpitas CA) Cheung Robin (Cupertino CA) Chang Mark (Los Altos CA) Lin Ming-Ren (Cupertino CA), Simplified dual damascene process for multi-level metallization and interconnection structure.

이 특허를 인용한 특허 (55)

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  31. Teng-Chun Tsai TW; Chia-Lin Hsu TW; Yung-Tsung Wei TW; Ming-Sheng Yang TW, Method for removing carbon-rich particles adhered on a copper surface.
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  54. Edelstein, Daniel C.; Grill, Alfred; Patel, Vishnubhai V.; Restaino, Darryl D., Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same.
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