초록 ▼

An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further

An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.

대표청구항 ▼

[ What is claimed is:] [1.]1. An integrated circuit comprising:a substrate;an insulator located over said substrate;a capacitor located over said substrate;a metallic adhesive located over said insulator; anda micromagnetic device, including;a ferromagnetic core located over said adhesive, said adhe

[ What is claimed is:] [1.]1. An integrated circuit comprising:a substrate;an insulator located over said substrate;a capacitor located over said substrate;a metallic adhesive located over said insulator; anda micromagnetic device, including;a ferromagnetic core located over said adhesive, said adhesive forming a bond between said insulator and said ferromagnetic core to secure said ferromagnetic core to said substrate, andat least one winding, located proximate said ferromagnetic core, to impart a desired magnetic property to said ferromagnetic core, said micromagnetic device electrically coupled to said capacitor.