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Rigid encapsulation package for semiconductor devices

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/12
  • H01L-023/02
  • H01L-023/495
출원번호 US-0232801 (1999-01-15)
발명자 / 주소
  • Nasiri Steven S.
  • Burns David W.
  • Bryzek Janusz
출원인 / 주소
  • Maxim Integrated Products, Inc.
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 59  인용 특허 : 46

초록

A rigid encapsulation package for semiconductor sensors, actuators, and devices is described. In one embodiment, a semiconductor pressure sensor includes a sensor element having a deformable diaphragm for measurement of pressure, and a cap that includes a recess. The cap is attached to the sensor el

대표청구항

[ What is claimed is:] [1.]1. A semiconductor device package, comprising:a semiconductor die including a deformable diaphragm;a protective cap having a recess, the cap attached to the semiconductor die to form a cavity between the semiconductor die and the cap;a pressure port coupled to the semicond

이 특허에 인용된 특허 (46)

  1. Bender Terrence D. (Hamel MN), Apparatus for mounting an absolute pressure sensor.
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  3. Donzier Eric P. (Blandy les Tours FRX) Rezgui Fadhel (Sceaux FRX), Diaphragm pressure sensor including anti-stock protection means and gradiomanometer incorporating such a sensor.
  4. Bonne Ulrich (Hopkins MN) Maurer D. Joseph (Pearl City IL), Differential pressure sensor with stress reducing pressure balancing means.
  5. Bryan James C. (Covina CA), Differential pressure transducers.
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  12. Mathias Milton W. (El Paso CO), High performance glass to metal solder joint.
  13. Knecht Thomas A. (Eden Prairie MN) Romo Mark G. (Richfield MN), Media isolated differential pressure sensors.
  14. Takahashi Yoshiharu (Hyogo JPX) Takemura Seiji (Hyogo JPX) Tsukui Keitaro (Hyogo JPX) Itoh Junko (Hyogo JPX) Nagai Eitaro (Hyogo JPX) Tada Yasuo (Hyogo JPX) Kishimoto Yuuji (Hyogo JPX) Kiguchi Sakae , Method of manufacturing semiconductor pressure sensor device with two semiconductor pressure sensor chips.
  15. Tobita Tomoyuki (Katsuta JPX) Yamamoto Yoshimi (Ibaraki JPX) Nagasu Akira (Ibaraki JPX) Aoki Ken\ichi (Katsuta JPX), Multi-function differential pressure sensor with thin stationary base.
  16. Kurtz Anthony D. (Teaneck NJ) Ned Alexander A. (Bloomingdale NJ), Piezoresistive accelerometer with enhanced performance.
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  18. French Patrick J. (Yokosuka JPX) Shinohara Toshiro (Yokosuka JPX), Piezoresistive semiconductor device suitable for use in a pressure sensor.
  19. Tobita Tomoyuki (Katsuta JPX) Sase Akira (Katsuta JPX), Pressure measuring sensor.
  20. Tominaga Tamotsu (Yokohama JPX) Mihara Teruyoshi (Yokohama JPX) Oguro Takeshi (Yokosuka JPX) Takeuchi Masami (Kokubunji JPX), Pressure sensor.
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  22. Brown Clem H. (Scottsdale AZ) Vowles David L. (Phoenix AZ), Pressure sensor with stress isolation platform hermetically sealed to protect sensor die.
  23. Glenn Max C. (Minnetonka MN) McMullen Raymond F. (Minnetonka MN) Wamstad David B. (Roseville MN), Pressure transducer.
  24. Karsmakers Mathijs Antonius (Eindhoven NL) Somers Gerardus Henricus Johannus (Eindhoven NL), Pressure transducer.
  25. Johnson Ralph H. (Plano TX) Brose ; II Ernest F. (Freeport IL), Pressure transducer with reduced offset signal.
  26. Knecht Thomas A. (Eden Prairie MN) Ruf James (Maple Grove MN) Schulte John P. (Eden Prairie MN), Pressure transducer with stress isolation for hard mounting.
  27. Takahashi Minoru (Katsuta JPX) Tanigami Takahiko (Mito JPX) Uchiyama Kaoru (Katsuta JPX) Minorikawa Hitoshi (Mito JPX) Nishihara Motohisa (Katsuta JPX) Kawakami Kanji (Katsuta JPX) Suzuki Seiko (Hita, Semiconductor absolute pressure transducer assembly and method.
  28. Tobita Tomoyuki (Katsuta JPX) Sase Akira (Katsuta JPX) Yamamoto Yoshimi (Naka JPX) Shimada Satoshi (Hitachi JPX), Semiconductor pressure converting device.
  29. Frische Richard H. (Phoenix AZ), Semiconductor pressure sensor.
  30. Saigusa Tokuji (Tokyo JPX) Yamagata Michiaki (Tokyo JPX) Aga Toshio (Tokyo JPX), Semiconductor pressure sensor.
  31. Takahashi Yoshiharu (Itami JPX) Hirose Tetsuya (Itami JPX) Ichiyama Hideyuki (Itami JPX), Semiconductor pressure sensor.
  32. Suzuki Seikou (Hitachiota JPX) Nishihara Motohisa (Katsuta JPX) Kawakami Kanji (Katsuta JPX) Sato Hideo (Hitachi JPX) Kobori Shigeyuki (Hitachi JPX) Hachino Hiroaki (Hitachi JPX) Takahashi Minoru (Ka, Semiconductor pressure sensor having plural pressure sensitive diaphragms and method.
  33. Moriyama Kyoichi,JPX ; Sakabe Katsumi,JPX ; Ichihashi Motomi,JPX, Semiconductor pressure sensor module.
  34. Jerman John H. (Palo Alto CA), Semiconductor transducer or actuator utilizing corrugated supports.
  35. Jerman John H. (Palo Alto CA), Semiconductor transducer or actuator utilizing corrugated supports.
  36. Jerman John H. (Palo Alto CA), Semiconductor transducer or actuator utilizing corrugated supports.
  37. Rosvold ; Warren C., Semiconductor transducer packaged assembly.
  38. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Franklin Lakes NJ) Nunn Timothy A. (Ridgewood NJ), Semiconductor transducers employing flexure frames.
  39. Knecht Thomas A. (Chanhassen MN) Romo Mark G. (Eden Prairie MN), Silicon side by side coplanar pressure sensors.
  40. Loeppert Peter V. (Rolling Meadows IL) Graber Warren S. (Rolling Meadows IL), Silicon-on-silicon differential input sensors.
  41. Youmans Albert P. (Cupertino CA), Solid state force transducer, support and method of making same.
  42. Wamstad David B. (Roseville MN), Stress sensitive semiconductor unit and housing means therefor.
  43. Marshall ; James F., Stress sensor apparatus.
  44. Frick Roger L. (Hackensack MN), Suspended diaphragm pressure sensor.
  45. Stephan Craig H. (Ann Arbor MI), Torsion beam accelerometer.
  46. Mallon Joseph R. (Franklin Lakes NJ) Kurtz Anthony D. (Englewood NJ), Transducer apparatus employing convoluted semiconductor diaphragms.

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  1. Nance, Christopher J.; Yelverton, John; Hart, Charles; Meadows, Michael, Apparatus for detonating a triaminotrinitrobenzene charge.
  2. Steven Webster, Bond wire pressure sensor die package.
  3. Nance, Christopher J.; McKellips, Christopher A.; Lucas, James D., Detonator cartridge.
  4. Nance, Christopher J; McKellips, Christopher A; Lucas, James D, Detonator cartridge and methods of use.
  5. Nance, Christopher J.; Segal, John P., Energetic material initiation device.
  6. Thanigachalam, Palani; Eckhardt, Todd; Wade, Richard, Force sensor.
  7. Wade, Richard, Force sensor.
  8. Wade, Richard, Force sensor.
  9. Bradley, Alistair David; Eckhardt, Todd; Jones, Ryan; Wade, Richard, Force sensor apparatus.
  10. Selvan, Thirumani A.; Sanjee, Raghu, Force sensor package and method of forming same.
  11. Kusanale, Vishal Shalitkumar; Thanigachalam, Palani; Eckhardt, Todd; Ricks, Lamar Floyd; Cook, Jim; Kashyap, Pavan R.; Murugesan, Vignesh, Gel filled port pressure sensor for robust media sealing.
  12. Gardner, Robert; DeRosa, Louis; Geras, Leo; Martin, Dick, High pressure flat plate transducer.
  13. Brown, Gregory C.; Rahn, Curtis, Integrated SOI pressure sensor having silicon stress isolation member.
  14. Hooper, Stephen R.; Stermer, Jr., William C., Integrated circuit package and method of forming the same.
  15. Sterling, James William; Gross, Steven, Integrated pressure sensor seal.
  16. Brown, Gregory C., Integrated reference vacuum pressure sensor with atomic layer deposition coated input port.
  17. Petrucelli, Steven, Low profile pressure sensor.
  18. Petrucelli, Steven, Low profile pressure sensor.
  19. Petrucelli, Steven, Low profile pressure sensor.
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  23. Suminto, James Tjanmeng; Yunus, Mohammad, Media-compatible electrically isolated pressure sensor for high temperature applications.
  24. Steven Webster, Method for forming a flip chip pressure sensor die package.
  25. Cairo, Ronald R.; Channel, Timothy; Cookson, Thomas, Method of measuring strain in a flex hose or other flexible member.
  26. Stephanou, Philip Jason; Burns, David William; Shenoy, Ravindra V., Microspeaker with piezoelectric, metal and dielectric membrane.
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  29. Burns,David W., Optical and electronic interface for optically coupled resonators.
  30. Burns,David W., Optically coupled resonant pressure sensor.
  31. Burns,David W., Optically coupled resonant pressure sensor and process.
  32. Burns, David W., Optically coupled resonator.
  33. Burns,David W., Optically coupled sealed-cavity resonator and process.
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  35. Stephanou, Philip Jason; Burns, David William, Piezoelectric microphone fabricated on glass.
  36. Stephanou, Philip Jason; Burns, David William, Piezoelectric microphone fabricated on glass.
  37. John L. Brock, Piezoelectric transducer assemblies and methods for their use.
  38. Chiou, Jen-Huang Albert; Ding, Xiaoyi; Chen, Shiuh-Hui Steven; Frye, Jeffrey J., Piezoresistive transducer with low thermal noise.
  39. Reynolds, Richard K.; Nance, Christopher J.; Cunningham, Andrew F., Plastic encapsulated energetic material initiation device.
  40. Reynolds, Richard K.; Nance, Christopher J.; Cunningham, Andrew F., Plastic encapsulated energetic material initiation device.
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  44. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale, Reduced thickness packaged electronic device.
  45. Ono, Kazuyuki; Maekawa, Tomofumi, Semiconductor device having a base, a cavity, a diaphragm, and a substrate.
  46. Loo,Kum Weng; Kho,Chek Lim, Semiconductor device package and method of manufacture.
  47. Chiou, Jen-Huang Albert; Chen, Shiuh-Hui Steven, Semiconductor sensing device to minimize thermal noise.
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  49. Prado, Leandro Westmann; Lopes, Ednei, Sensor assembly with resilient contact portions.
  50. Elian, Klaus; Meyer-Berg, Georg; Theuss, Horst, Sensor device and method.
  51. Elian, Klaus; Meyer-Berg, Georg; Theuss, Horst, Sensor device having a porous structure element.
  52. Elian, Klaus; Meyer-Berg, Georg; Theuss, Horst, Sensor device having a structure element.
  53. Dangtran, John; Horton, Roger, Sensor device packaging.
  54. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale, Structure for backside saw cavity protection.
  55. Brown, Gregory C., Systems and methods for a pressure sensor having a two layer die structure.
  56. Wade, Richard; Ricks, Lamar Floyd, Temperature compensated force sensor.
  57. Kurtz, Anthony D.; Kane, Adam; Kochman, Boaz, Torque insensitive header assembly.
  58. Stephanou, Philip Jason; Burns, David William; Shenoy, Ravindra V., Transducer with piezoelectric, conductive and dielectric membrane.
  59. Rozgo, Paul; Bradley, Alistair; Jones, Ryan S.; Ricks, Lamar F., Wet/wet differential pressure sensor based on microelectronic packaging process.
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