[특허]Thermal conductive unit and thermal connection structure using the same

Thermal conductive unit and thermal connection structure using the same 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F28F-007/00
출원번호	US-0319774 (1999-06-11)
우선권정보	JP0280134 (1997-10-14)
국제출원번호	PCT/JP98/04568 (1998-10-12)
§371/§102 date	19990611 (19990611)
국제공개번호	WO-9919908 (1999-04-22)
발명자 / 주소	Fujiwara Norio,JPX Akiba Yasuhiro,JPX Watanabe Tetsuyuki,JPX Nishiki Naomi,JPX
출원인 / 주소	Matsushita Electric Industrial Co., Ltd., JPX
대리인 / 주소	Wenderoth, Lind & Ponack, L.L.P.
인용정보	피인용 횟수 : 43 인용 특허 : 15

초록 ▼

In a heat conducting unit, a heat conducting member composed of a material with good heat conductivity shaped in correspondence with the shape of a heat path is contained in a container made of a flexible sheet having a given thickness. The heat conducting member contained in the container connects at least two parts at different temperatures to form the heat path for efficiently transferring heat generated in a higher-temperature part to a lower-temperature part. Heat is dissipated away from the lower-temperature part through the heat path to cool the higher-temperature part.

대표청구항 ▼

[ What is claimed is:] [1.]1. A heat conducting unit for use with a high temperature part and a low temperature part, and for use in transferring heat generated in the high temperature part to the low temperature part via a heat path, said heat conducting unit comprising:a container composed of a flexible sheet; andat least one flexible graphite sheet, capable of being shaped in accordance with the heat path, located in said container and thermally connected to said flexible sheet of said container;wherein said at least one graphite sheet is to be thermally connected to the high temperature part and the low temperature part via said flexible sheet and is to be shaped in accordance with the heat path;wherein said flexible sheet is composed of a high-molecular compound; andwherein said high-molecular compound is polyester having a thickness of 20 to 30 .mu.m.

이 특허에 인용된 특허 (15)

Chao Shun-Lung (Westboro MA), Arrangement for mounting and cooling high density tab IC chips.
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Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
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Ozmat Burhan (Dallas TX) Gordon Robert J. (Coppell TX), Constraining core for surface mount technology.
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Mercuri Robert Angelo ; Capp Joseph Paul ; Gough Jeffrey John, Flexible graphite composite.
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Larson Ralph (Bolton MA) Phillips Richard J. (Alachua FL), Flexible heat pipe for integrated circuit cooling apparatus.
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Jean Amigo (No. 18 ; Alley S ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Flexible heat transfer device.
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Tousignant Lew A. (St. Paul MN), Heat transfer bag with thermal via.
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Dickinson Richard C. (Arlington Heights IL), Heat transfer element having the thermally conductive fibers.
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Kitahara Takashi,JPX ; Shimanuki Tadayoshi,JPX, Heat-generating element cooling device.
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Schmidt Detlef ; Pais Martin R., Hybrid substrate for cooling an electronic component.
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Yao Akira,JPX, Interface portion structure and reinforcing structure of flexible thermal joint.
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Fick Herbert J. (Northfield MN), Interfacing of heat sinks with electrical devices, and the like.
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LeVasseur Robert D. (Binghamton NY) McKeown Stephen A. (Endicott NY), Low thermal expansion, heat sinking substrate for electronic surface mount applications.
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Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX), Mounting for printed circuits forming a heat sink with controlled expansion.
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Przilas Mark B. (Greenville TX), Tapered thermal substrate for heat transfer applications and method for making same.
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이 특허를 인용한 특허 (43)

Wayman, Michael J., Apparatus for spreading heat over a finned surface.
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Wayman, Michael J.; Nelson, Michael J., Apparatus for transferring heat in a fin of a heat sink.
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Bronczyk, Steven A.; Tom, Kwok; Koetting, William, Battery cell assemblies.
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Koetting, William; Tom, Kwok; Klein, Martin J.; Patil, Prabhakar; Kebl, Kelly, Battery cell assembly and method for assembling the battery cell assembly.
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Koetting, William; O'Kane, Sean; Tom, Kwok; Payne, Josh, Battery cell assembly, heat exchanger, and method for manufacturing the heat exchanger.
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Matejek, Bob; Niedzwiecki, Mark; Phillips, Greg; Yang, Hee Kook; Symons, Bryan; Merriman, Bob, Battery disconnect unit and method of assembling the battery disconnect unit.
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Payne, Josh, Battery module and method for manufacturing the battery module.
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Khakhalev, Alex, Battery module and methods for bonding cell terminals of battery cells together.
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Niedzwiecki, Mark; Yang, Heekook; Isayev, Igor, Battery module having battery cell assemblies with alignment-coupling features.
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Koetting, William; Payne, Josh, Battery module having cooling manifold and method for cooling battery module.
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Koetting, William; Payne, Josh; Tom, Kwok, Battery module having cooling manifold with ported screws and method for cooling the battery module.
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Yang, Jae Hun, Battery module of high cooling efficiency.
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Khakhalev, Alex; Isayev, Igor, Battery modules having interconnect members with vibration dampening portions.
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Gadawski, Thomas J., Battery system and manifold assembly having a manifold member and a connecting fitting.
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Gadawski, Thomas J., Battery system and manifold assembly with two manifold members removably coupled together.
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Payne, Josh, Battery systems, battery module, and method for cooling the battery module.
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Koetting, William; Payne, Josh, Battery systems, battery modules, and method for cooling a battery module.
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Payne, Josh, Battery systems, battery modules, and method for cooling a battery module.
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Nikkhoo, Michael, Bonded multi-layer graphite heat pipe.
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Nikkhoo, Michael; Hurbi, Erin, Carbon nanoparticle infused optical mount.
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Wells, Robert Grayson; Beak, Todd David, Circuit card module including mezzanine card heat sink and related methods.
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Gadawski, Thomas J., Connecting assembly.
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Petricek,Martin; Rothmayer,Thomas, Electronic device.
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Ratliff, William Edward; Sealander, Jacob Leland, Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between.
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Ukegawa, Hiroshi; Liu, Yanghe; Zhou, Feng; Joshi, Shailesh N.; Dede, Ercan, Electronics assemblies incorporating three-dimensional heat flow structures.
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Gadawski, Thomas J., End cap.
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Koetting, William; Tom, Kwok; Payne, Josh, Frame member, frame assembly and battery cell assembly made therefrom and methods of making the same.
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Nishikawa, Kazuhiro; Nishiki, Naomi; Kitaura, Hidetoshi; Nakaya, Kimiaki; Tanaka, Atsushi, Graphite structure, and electronic device using the same.
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McLaughlin, Robyn Rebecca Reed; Stellman, Jeffrey Taylor; Hill, Andrew, Heat dissipation in electronics with a heat spreader.
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Wu,Chung Ju, Heat dissipation mechanism for electronic apparatus.
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Weaver, Jr., Stanton Earl; Deng, Tao; de Bock, Hendrik Pieter Jacobus; Chauhan, Shakti Singh, Heat exchange assembly for use with electrical devices and methods of assembling an electrical device.
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Chen,Wei Liang; Wu,Wei Ming, Heat sink structure with flexible heat dissipation pad.
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Shirakami, Takashi; Yamazaki, Naoya; Iino, Kazuhiro; Tada, Yoshiaki; Ueda, Satoshi, Heat transfer mechanism, heat dissipation system, and communication apparatus.
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Fujiwara,Norio, Heat-radiating structure of electronic apparatus.
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Yoon, Junill; Ro, Jong-yul; Yoon, Yeo Won; Yang, Heekook; Ahn, Jaesung, Housing member for battery module.
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Overmann,Scott P.; McKinley,John T.; Martin,Clarence A.; Grimmett,Jacky D.; O'Connor,John P., Mechanically adjustable thermal path for projection display device cooling.
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Nikkhoo, Michael; Hurbi, Erin, Metal encased graphite layer heat pipe.
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Krassowski,Daniel Witold; Shives,Gary D.; Norley,Julian; Reynolds, III,Robert Anderson, Sandwiched finstock.
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Fujiwara, Kikuo; Tozawa, Masaaki; Shives, Gary D.; Norley, Julian; Reynolds, III, Robert Anderson, Sandwiched thermal solution.
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Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for electronic devices.
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Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for portable electronic devices.
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Ono,Atsushi; Nishiura,Koei; Hanamura,Satoshi, Thermal transferring member, test board and test apparatus.
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Kubo, Kazuhiko; Nakayama, Masafumi, Thermally conductive body and electronic device using same.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

연합인증

Thermal conductive unit and thermal connection structure using the same 원문보기