초록 ▼

An electronic assembly that may include a two-phase material that absorbs heat generated by an integrated circuit. The heat may be transferred from the integrated circuit to the two-phase material by a heat pipe. The two-phase material can absorb heat in an isothermal process utilizing the latent he

An electronic assembly that may include a two-phase material that absorbs heat generated by an integrated circuit. The heat may be transferred from the integrated circuit to the two-phase material by a heat pipe. The two-phase material can absorb heat in an isothermal process utilizing the latent heat of the material. The isothermal process allows the two-phase material to absorb heat generated by the integrated circuit without raising the temperature of the assembly.

대표청구항 ▼

[ What is claimed is:] [1.]1. An electronic assembly comprising:a housing;an integrated circuit package that has a lid;a heat sink that is coupled to said integrated circuit package;a two-phase material that is located within the housing, the two-phase material changes from a solid phase to a liquid

[ What is claimed is:] [1.]1. An electronic assembly comprising:a housing;an integrated circuit package that has a lid;a heat sink that is coupled to said integrated circuit package;a two-phase material that is located within the housing, the two-phase material changes from a solid phase to a liquid phase in response to an increase in temperature of the integrated circuit package; and,a heat pipe that is thermally coupled to the integrated circuit package lid, the heat pipe includes a first end thermally coupled to the lid of the integrated circuit package and a second end in contact with the two-phase material so that the heat pipe extends from the integrated circuit package through said heat sink and into the two-phase material.