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Electroplating machine 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-014/00
  • C25D-017/00
출원번호 US-0436087 (1999-11-08)
발명자 / 주소
  • Huang Pin Chun,TWX
  • Lee Fang Hao,TWX
출원인 / 주소
  • Shipley Company, LLC
대리인 / 주소
    Fish & Neave
인용정보 피인용 횟수 : 9  인용 특허 : 26

초록

An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of t

대표청구항

[ What is claimed is:] [1.]1. An electroplating apparatus including an apparatus for allowing the variation of the distance between a first roller and a second roller, wherein each of said first and second rollers comprises an axle about which each respective roller is rotatable, said apparatus comp

이 특허에 인용된 특허 (26)

  1. Nakamura ; Masahiro ; Tsuda ; Tetsuaki ; Amakata ; Hajime, Apparatus for continuously electroplating on only a single surface of running metal strip.
  2. Yamaguchi ; Seiichi, Continuous electroplating apparatus.
  3. Spain Robert J. (Newton MA) Glassman Steven P. (Randolph MA), Conveyorized spray plating machine.
  4. Kallweit Manfred (Berlin DEX), Device for cleaning or chemical treatment or workpieces.
  5. Blsing Horst (Berlin DEX) Kosikowski Thomas (Nrnberg DEX) Mankut Ludwig (Altdorf DEX) Meyer Walter (Berlin DEX), Device for the electroplating treatment of plate-shaped objects.
  6. Pender Don P. (1121 E. Wesleyan Dr. Tempe AZ 85282), Dynamic flood conveyor.
  7. Denofrio Charles (117 Oregon Ave. West Dundee IL 60118), Electroplating apparatus.
  8. Brady Joseph M. (Huntingdon PA) Cordes Franz R. (State College PA) Gedrat Klaus H. (Berlin NJ DEX) Goffredo Daniel L. (Riverton NJ) Meyer Walter (Berlin PA DEX) Shakley Conrad D. (Spring Mills PA), Electroplating apparatus and method.
  9. Brady Joseph M. (Huntingdon PA) Cordes Franz R. (State College PA) Gedrat Klaus H. (Berlin NJ DEX) Goffredo Daniel L. (Riverton NJ) Meyer Walter (Berlin PA DEX) Shakley Conrad D. (Spring Mills PA), Electroplating apparatus and method.
  10. Hosten Daniel (Handzame BEX), Electroplating apparatus for plate-shaped workpieces.
  11. Hosten Daniel (Handzame DEX), Electroplating apparatus for plate-shaped workpieces.
  12. Hosten Daniel (Handzame DEX) Floegel Lothar (Neuried DEX), Electroplating apparatus for plate-shaped workpieces.
  13. Hosten Daniel (Handzame BEX), Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards.
  14. Hosten Daniel (Handzame BEX), Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards.
  15. Hosten Daniel (Handzeme BEX), Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards.
  16. Hosten Daniel (Handzame BEX) Van Puymbroeck Josef (Oostkamp BEX), Electroplating means for perforated printed circuit boards to be treated in a horizontal pass.
  17. Collins ; Jr. Albert Lee ; Boyd Rick Alan ; Bradshaw II Herbert Lester ; Huber Alvin Jerome ; Wessner Charles Thomas ; Ruch Dennis Bowman, Ground rod and apparatus and method for electroplating.
  18. Usuda Hitoshi (Kanuma JPX) Yamakawa Ryoei (Utsunomiya JPX) Ueno Kenichi (Fujisawa JPX) Hirao Kazuhiro (Hadano JPX), Horizontal carrying tape electroplating apparatus.
  19. Matsuda Shozo (Tokyo JA) Tanaka Tadashi (Yokohama JA) Oka Joji (Kawasaki JA) Ayusawa Saburo (Kisarazu JA) Iwasaki Kiyotoshi (Kisarazu JA) Teramachi Toshiyuki (Kimitsu JA) Miyazono Toshitake (Kimitsu , Horizontal rectilinear type metal-electroplating method.
  20. Ott Rudi (Sachsenheim DEX) Reith Heribert (Stuttgart DEX), Method and apparatus for continuously galvanizing flat workpieces, and especially printed circuit boards.
  21. Ando Narumi (Tokyo JPX) Oda Kito (Futtsu JPX) Saiki Takashi (Kisarazu JPX) Hashimoto Yoshiaki (Kisarazu JPX) Tsuyuki Akira (Kimitsu JPX) Kitazawa Yoshio (Tokyo JPX), Method and apparatus for the continuous electrolytic treatment of a metal strip using insoluble horizontal electrodes.
  22. Haase Peter (Feucht DEX) Kosikowski Thomas (Nuremberg DEX) Steger Horst (Altdorf DEX), Method and device for feeding plate shaped objects into and from suspension frames of an installation for chemical treat.
  23. Blasing Horst (Berlin DEX) Maurer Manfred (Heideck DEX) Schroder Rolf (Burgthann DEX), Method for controlling the work cycle of electroplating plants.
  24. Ketelhohn Karl F. G. (State College PA), Process and apparatus for intermittent fluid application.
  25. Hosten Daniel (Handzame BEX), Treatment facility particularly for printed circuit boards to be treated while in a horizontal plane.
  26. Smith Stanley B. (Boalsburg PA) Blakeslee G. Allen (Bellefonte PA), Treatment method and apparatus for printed circuit boards and the like.

이 특허를 인용한 특허 (9)

  1. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
  2. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
  3. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
  4. Chandrasekhar, Prasanna; Zay, Brian J.; Modes, Sr., Richard; LaRosa, Anthony; Hobin, Kyle, Electrochemical deposition apparatus and methods of using the same.
  5. Chandrasekhar, Prasanna; Zay, Brian J.; Laganis, Edward J.; Romanov, Vasily V.; LaRosa, Anthony J., Electrochromic eyewear.
  6. Binstead,Robert A.; Younes Metzler,Osnat; Valeri,David A.; Mikkola,Robert D., Electrode, electrochemical cell, and method for analysis of electroplating baths.
  7. Glassman,Steven P., High efficiency plating apparatus and method.
  8. Chandrasekhar, Prasanna; Chai, Yanjie, Potentiostat/galvanostat with digital interface.
  9. Chandrasekhar, Prasanna, Variable-emittance electrochromic devices and methods of preparing the same.
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