초록 ▼

Phase Change Material ("PCM") are used to reduce the range of temperature excursions in a semiconductor die attached to an interconnect substrate in the flip chip technology. In one embodiment a PCM underfill, which comprises PCM microspheres interspersed within a polymer, is dispensed in the interf

Phase Change Material ("PCM") are used to reduce the range of temperature excursions in a semiconductor die attached to an interconnect substrate in the flip chip technology. In one embodiment a PCM underfill, which comprises PCM microspheres interspersed within a polymer, is dispensed in the interface area between the semiconductor die and the interconnect substrate. Reduction of the range of temperature excursions in the semiconductor die is achieved since the PCM underfill acts as a cushion to dampen the range of temperature excursions of the semiconductor die. During dissipation of power pulses in the semiconductor die, the PCM underfill absorbs energy from the semiconductor die by changing phase from solid to liquid without a concomitant rise in the temperature of the PCM underfill. Thus, the energy released when power pulses are being dissipated in the semiconductor die does not result in a rise in the temperature of the PCM underfill. Accordingly, the temperature of the semiconductor die which is in thermal contact with the PCM underfill is not abruptly increased during power pulses. Similarly, during the time that no power pulse is being dissipated by the semiconductor die, the PCM underfill releases the stored energy by changing phase from liquid to solid while maintaining a constant temperature. Thus, the temperature of the semiconductor die which is in thermal contact with the PCM underfill is not abruptly decreased when no power pulse is being dissipated in the semiconductor die.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method comprising the steps of:planting a plurality of solder bumps on a first surface of a semiconductor die;dispensing a layer of PCM underfill between said first surface of said semiconductor die and an interconnect substrate, said layer of PCM underfill absorbing

[ What is claimed is:] [1.]1. A method comprising the steps of:planting a plurality of solder bumps on a first surface of a semiconductor die;dispensing a layer of PCM underfill between said first surface of said semiconductor die and an interconnect substrate, said layer of PCM underfill absorbing and releasing heat from said semiconductor die so as to reduce a range of temperature excursions occurring in said semiconductor die.