초록 ▼

The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technolog

The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

대표청구항 ▼

[ What is claimed is:] [1.]1. A radiation shielding multi-chip module, comprising:a radiation shielding base with a plurality of non-conducting feedthroughs;a radiation shielding lid, secured to said radiation shielding base;a substrate with a plurality of integrated circuit devices attached to a to

[ What is claimed is:] [1.]1. A radiation shielding multi-chip module, comprising:a radiation shielding base with a plurality of non-conducting feedthroughs;a radiation shielding lid, secured to said radiation shielding base;a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to an inside of said radiation shielding base; anda plurality of package leads passing through said plurality of non-conducting feedthroughs, wherein said plurality of package leads are attached to said top and bottom sides of said substrate and electrically attached to said plurality of integrated circuit devices attached to said top side of said substrate and said plurality of integrated circuit devices attached to said bottom side of said substrate;wherein said radiation shielding base and said radiation shielding lid have thicknesses sufficient to shield said plurality of integrated circuit devices attached to said top side of said substrate and said plurality of integrated circuit devices attached to said bottom side of said substrate from receiving an amount of radiation greater than a total dose tolerance of said plurality of integrated circuit devices attached to said top side of said substrate and said plurality of integrated circuit devices attached to said bottom side of said substrate.