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특허 상세정보

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System and method for handling and masking a substrate in a sputter deposition system

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C23C-014/32    C23C-014/50    C23C-016/04   
미국특허분류(USC) 204/192.12 ; 204/298.11 ; 204/298.14 ; 204/298.15 ; 427/526 ; 118/720 ; 118/721 ; 118/728 ; 118/729 ; 118/730 ; 118/503 ; 118/504
출원번호 US-0547522 (2000-04-12)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Skjerven Morrill MacPherson LLPParsons
인용정보 피인용 횟수 : 14  인용 특허 : 32
초록
▼

A substrate handling system auxiliary to a plasma sputtering system is described. The substrate handling system inserts an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask into a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks then are moved to a sputtering chamber where the substrate is coated by sputtering. Subsequently, the substrate handling system moves a processed substrate, and its accompanying inner mask and an outer mask, from the loadlock to an exte...

대표
청구항
▼

[ What is claimed is:] [35.]35. A method of masking a substrate having a first surface that is to be coated in a sputtering system, said substrate having a central first aperture, the method comprising:providing an inner mask having a first body with a central second aperture at a first end thereof and an opposite second end, said second aperture extending vertically through said first body toward said second end, and an annular head at the first end of said first body around said second aperture, said head extending away from the central aperture; andin...

이 특허에 인용된 특허 (32)

  1. Reising Michael (Mombris DEX) Kempf Stefan (Alzenau DEX) Konig Michael (Frankfurt DEX). Apparatus for gripping a flat substrate. USP1997095669652.
  2. Zejda Jaroslav,DEX ; Kempf Stefan,DEX. Apparatus for gripping a flat substrate. USP1998095803521.
  3. Helms Dirk (Ahrensburg DEX) Katzschner Werner (Berlin DEX) Pawlakowitsch Anton (Alzenau DEX) Anderle Friedrich (Hanau DEX). Apparatus for mounting workpieces. USP1989094869801.
  4. Walde Michael (Rodenbach DEX) Zejda Jaroslav (Rodenbach DEX). Apparatus for passing workpieces into and out of a coating chamber through locks. USP1989044820106.
  5. Beardow Terence (Endenfield GB2). Apparatus for sputter coating discs. USP1987104701251.
  6. Kempf Stefan (Alzenau DEX). Apparatus for synchronizing loading and unloading of substrates with turntable movement in a coating chamber. USP1995045407314.
  7. Zejda Jaroslav (Rodenbach DEX). Apparatus for the insertion and removal of a mask through the airlock of a vacuum coating apparatus. USP1994105354380.
  8. Kempf Stefan (Alzenau DEX) Zejda Jaroslav (Rodenbach DEX). Apparatus for the inward and outward transfer of a workpiece in a vacuum chamber. USP1992055112469.
  9. Kempf Stefan (Alzenau DEX) Sichmann Eggo (Gelnhausen DEX). Apparatus for the transfer of substrates. USP1997035612068.
  10. Kempf Stefan,DEX ; Konig Michael,DEX. Apparatus for transfer of workpieces into and out of a coating chamber. USP1998085791851.
  11. Anderle Friedrich (Hanau am Main DEX) Costescu Dan L. (Hainburg DEX) Kempf Stefan (Alzenau DEX) Novak Emmerich (Obertshausen DEX) Zejda Jaroslav (Rodenbach DEX). Apparatus on the carousel principle for coating substrates. USP1989124886592.
  12. Zejda Jaroslav (Rodenbach DEX). Cathode sputtering system. USP1990074938858.
  13. Zejda Jaroslav (Rodenbach DEX) Schuhmacher Manfred (Alzenau-Michelbach DEX). Cathode sputtering system. USP1990074943363.
  14. Sichmann Eggo,DEX. Device for cathode sputtering. USP1999015863399.
  15. Kempf Stefan,DEX ; Reising Michael,DEX. Device for gripping and holding substrates. USP1999035876082.
  16. Kempf Stefan,DEX. Device for masking or covering substrates. USP1998095800687.
  17. Kempf Stefan (Alzenau DEX). Device for transferring a workpiece into and out from a vacuum chamber. USP1993115259942.
  18. Kempf Stefan,DEX. Device for transporting substrates. USP1999065913653.
  19. Hashimoto Hajime (Kyoto JPX) Kubota Kazuo (Kyoto JPX) Inoue Daisuke (Kyoto JPX) Nogawa Syuichi (Kyoto JPX). Film forming apparatus. USP1997105674368.
  20. Ackley James W. (Los Altos CA). Load lock pumping mechanism. USP1985084534314.
  21. Mack Alfred (Poughkeepsie NY) O\Neill Brian C. (Millbrook NY) Penzetta Fred L. (Wappingers Falls NY). Low shock transmissive antechamber seal mechanisms for vacuum chamber type semi-conductor wafer electron beam writing ap. USP1982104355937.
  22. Zejda Jaroslav (Rodenbach DEX). Mask for covering the margin of a disk-shaped substrate. USP1996015480530.
  23. Kempf Stefan (Alzenau DEX). Method and apparatus for the step-by-step and automatic loading and unloading of a coating apparatus. USP1995095451130.
  24. Rubin Richard H. (West Paterson NJ) Hillman Gary (Livingston NJ) Zarr Lewis E. (Sparta NJ) Hayes William K. (Parsippany NJ). Process apparatus and method and elevator mechanism for use in connection therewith. USP1987084685852.
  25. Steinke Rudi (Hanau DEX) Schittny Stefan (Alzenau-Kaelberau DEX) Kempf Bernd (Freigericht DEX) Groll Werner (Alzenau-Hoerstein DEX). Solder alloy for dental and jewelry parts. USP1993085240172.
  26. Messer Mark G. (Los Gatos CA) Stark Lawrence R. (San Jose CA). Sputter module for modular wafer processing system. USP1987064670126.
  27. Kempf Stefan,DEX. Substrate transporting apparatus. USP1999035879121.
  28. Hutchinson, Martin A.; Shaw, R. Howard; Coad, George. Transfer plate rotation system. USP1985104548699.
  29. Kawashima Sosuke (Kudamatsu JPX) Ichihashi Kazuaki (Kudamatsu JPX). Vacuum processing apparatus. USP1987104699554.
  30. Turner Frederick T. (Sunnyvale CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. Howard (Palo Alto CA) Lamont ; Jr. Lawrence T. (Mountain View CA). Wafer coating system. USP1988074756815.
  31. Dimock Jack A. (Santa Barbara CA). Wafer processing machine. USP1985064523985.
  32. Garrett Charles B. (San Jose CA). Workpiece lifting and holding apparatus. USP1986054588343.

이 특허를 인용한 특허 피인용횟수: 14

  1. Rinaldi, Kenneth James. Apparatus and method for forming reflective layer of optical disc. USP2011077978583.
  2. Ulrich Speer DE; Klaus Weber DE. Apparatus and method for handling substrates. USP2002126494511.
  3. Ken Lee ; Ke Ling Lee ; Mingwei Jiang ; Robert M. Martinson. Horizontal sputtering system. USP2002076413381.
  4. Aggarwal, Ravinder K.; Stoutjesdijk, Jeroen; Hill, Eric R.; Davis, Loring G.; DiSanto, John T.. Load lock having secondary isolation chamber. USP2015018927435.
  5. Aggarwal, Ravinder; Stoutjesdijk, Jeroen; Hill, Eric; Davis, Loring G.; DiSanto, John T.. Load lock having secondary isolation chamber. USP2013058440048.
  6. Raaijmakers,Ivo; Aggarwal,Ravinder; Kusbel,James. Loadlock with integrated pre-clean chamber. USP2006037018504.
  7. Disteldorf,Bernd. Method of making vehicle windshield using coating mask. USP2006107125462.
  8. McLeod, Paul Stephen. Multi-layer deposition process using four ring sputter sources. USP2003086605195.
  9. Visscher, Albert. Object carrier for a particle-optical apparatus. USP2003076593581.
  10. Yamagishi, Takayuki; Suwada, Masaei; Watanabe, Takeshi. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections. USP2005056899507.
  11. Yamagishi,Takayuki; Suwada,Masaei; Watanabe,Takeshi. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections. USP2006047021881.
  12. Seddon, Richard I.. Substrate holder for a vapour deposition system. USP2010097790004.
  13. Barnes, Michael S.; Bluck, Terry. System and method for processing substrates with detachable mask. USP2014088795466.
  14. Ke Ling Lee ; Mikhail Mazur ; Ken Lee ; Robert M. Martinson. System and method for transporting and sputter coating a substrate in a sputter deposition system. USP2002066406598.

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