초록 ▼

A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom packag

A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

대표청구항 ▼

[ What is claimed is:] [1.]1. A packaged semiconductor device assembly having leads on a bottom thereof comprising:a semiconductor die;a lead frame including at least one lead with upper surface, lower surface, and side surfaces, said at least one lead comprising:an inner lead connected to said semi

[ What is claimed is:] [1.]1. A packaged semiconductor device assembly having leads on a bottom thereof comprising:a semiconductor die;a lead frame including at least one lead with upper surface, lower surface, and side surfaces, said at least one lead comprising:an inner lead connected to said semiconductor die;an intermediate portion connected to a first electrical apparatus; andan outer lead connected to a second electrical apparatus, said outer lead extending horizontally from said intermediate portion; anda package enclosure enclosing said semiconductor die and the inner lead of said at least one lead, said package enclosure having top surface, bottom surface and side surfaces, a lower surface of said intermediate portion of said at least one lead generally extending with said bottom surface of said package enclosure and exposed to connect to a lead of another electrical apparatus, portions of the package enclosure adjacent the side surfaces of said intermediate portion of said at least one lead being excised exposing at least a portion of each side surface of said side surfaces of said at least one lead.