초록 ▼

A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, su

A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

대표청구항 ▼

[ What is claimed is:] [1.]1. A multichip module for housing multiple integrated circuit dies comprising:a housing for holding a plurality of dies;a plurality of integrated circuit dies mounted within said housing;a plurality of interconnect dies mounted within said housing, each of said interconnec

[ What is claimed is:] [1.]1. A multichip module for housing multiple integrated circuit dies comprising:a housing for holding a plurality of dies;a plurality of integrated circuit dies mounted within said housing;a plurality of interconnect dies mounted within said housing, each of said interconnect dies being physically located between at least two of said integrated circuit dies, wherein at least one of said interconnect dies is electrically connected to at least two of said integrated circuit dies and to at least one other said interconnect die; anda plurality of electrically conductive leads extending from said housing.