초록 ▼

A sputter deposition apparatus and method having a sputtering target that is tilted and a shield that intercepts particles that may fall from the target so that the particles do not deposit on the workpiece. The invention permits the workpiece to be oriented horizontally. More specifically, the sput

A sputter deposition apparatus and method having a sputtering target that is tilted and a shield that intercepts particles that may fall from the target so that the particles do not deposit on the workpiece. The invention permits the workpiece to be oriented horizontally. More specifically, the sputtering target is mounted higher than the workpiece position and is oriented at an angle of 30 to 60 degrees relative to the vertical axis. The shield occupies an area such that any vertical line extending vertically downward from the front surface of the target to a point on the workpiece intersects the shield above said point.

대표청구항 ▼

[ What is claimed is:] [17.]17. A method for sputter deposition of material from a sputtering target onto an electronic substrate, comprising the steps of:mounting a first sputtering target within a vacuum chamber, whereinthe first target has a front surface facing generally downward and a rear surf

[ What is claimed is:] [17.]17. A method for sputter deposition of material from a sputtering target onto an electronic substrate, comprising the steps of:mounting a first sputtering target within a vacuum chamber, whereinthe first target has a front surface facing generally downward and a rear surface facing generally upward,the front surface is characterized by a width and a length such that the width is less than or equal to the length, andthe front surface is oriented at an angle in the range of 30 to 60 degrees, inclusive, relative to a vertical line;positioning an electronic substrate at one or more workpiece positions within the vacuum chamber, wherein said one or more workpiece positions include one or more workpiece positions that are below the first target;mounting a first set of one or more magnets so that each magnet of the first set has a north magnetic pole mounted adjacent the rear surface of the first target, wherein the north magnetic poles of the magnets of the first set are mounted at a collective average distance from the front surface of the first target that is less than the width of the front surface of the first target;mounting a second set of one or more magnets so that each magnet of the second set has a south magnetic pole mounted adjacent the rear surface of the first target, wherein the south magnetic poles of the magnets of the second set are mounted at a collective average distance from the front surface of the first target that is less than the width of the front surface of the first target; andsputtering material from the first target onto the electronic substrate while the electronic substrate is positioned at one of said one or more workpiece positions that are below the first target;wherein the first and second sets of magnets collectively produce a magnetic field at the front surface of the first target having a magnitude substantially greater than any other magnetic field at the front surface.