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Electro-chemical deposition system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25B-015/00
출원번호 US-0350210 (1999-07-09)
발명자 / 주소
  • Dordi Yezdi
  • Malik Muhammad Atif
  • Hao Henan
  • Franklin Timothy H.
  • Stevens Joe
  • Olgado Donald
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Thomason, Moser & Patterson LLP
인용정보 피인용 횟수 : 88  인용 특허 : 41

초록 ▼

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical dep

대표청구항 ▼

[ What is claimed is:] [1.]1. An electro-chemical deposition system, comprising:a) a mainframe having a mainframe wafer transfer robot;b) a loading station disposed in connection with the mainframe;c) one or more processing cells disposed in connection with the mainframe;d) an electrolyte supple flu

이 특허에 인용된 특허 (41)

  1. Watson Angus (Bricktown NJ), Acid copper electroplating baths containing brightening and leveling additives.
    상세보기
  2. Konishi Nobuo (Tokyo JPX) Sekiguchi Kenji (Tokyo JPX), Apparatus for removing process liquid.
    상세보기
  3. Kozai ; Teruo ; Ohara ; Shigeharu ; Suzuki ; Hiroshi ; Yanagihara ; Shin go, Apparatus for washing semiconductor wafers.
    상세보기
  4. Eckles William E. (Cleveland OH) Bishop Craig V. (Cleveland OH) Vaitekunas Peter T. (Cleveland OH), Automatic analyzer and control system for electroplating baths.
    상세보기
  5. Sago Hiroyoshi (Kanagawa JPX) Fujiyama Shigemi (Kanagawa JPX) Kudo Katsuhiko (Kanagawa JPX) Kumazawa Hirotsugu (Kanagawa JPX), Cleaning device for cleaning planar workpiece.
    상세보기
  6. Rattan William D. (San Jose CA) Walwyn Craig M. (San Jose CA), Disc cleaning machine.
    상세보기
  7. Brewer James M. (Austin TX), Edge bead removal process for spin on films.
    상세보기
  8. Poris Jaime, Electrodeposition apparatus with virtual anode.
    상세보기
  9. Mayer Linda J. (Denville NJ) Barbieri Stephen C. (Rutherford NJ), Electrodeposition of bright copper.
    상세보기
  10. Creutz ; deceased ; Hans-Gerhard ; Herr ; Roy W., Electrodeposition of copper.
    상세보기
  11. Johnston Samuel J. B. (Ashford GB2), Electroplating arrangements.
    상세보기
  12. Martin Sylvia (Shelby Township ; Macomb County MI), Functional fluid additives for acid copper electroplating baths.
    상세보기
  13. Chizinsky George (143 West St. Beverly Farms MA 01915), Heated plate rapid thermal processor.
    상세보기
  14. Crank Sue E. (Coppell TX), Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer.
    상세보기
  15. Yamamura Takayoshi (Hamamatsu JPX) Endo Yoshihisa (Hamamatsu JPX) Shinmura Akira (Hamamatsu JPX), Metal plating apparatus.
    상세보기
  16. Shortes Samuel R. (Plano TX) Millis Edwin Graham (Dallas TX), Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water.
    상세보기
  17. Bunkofske Raymond James, Method and apparatus for coating a semiconductor wafer.
    상세보기
  18. Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Method for single wafer processing in which a semiconductor wafer is contacted with a fluid.
    상세보기
  19. Goffman Martin (Edison NJ) Kudryk Val (Closter NJ), Method for the electrodeposition of metals.
    상세보기
  20. Mullarkey Edward J. (5501 Seminary Rd. ; No. 1404 S. Falls Church VA 22041), Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like.
    상세보기
  21. Raistrick Ian D. (Menlo Park CA) Poris Jaime (Portola Valley CA) Huggins Robert A. (Stanford CA granted to U.S. Department of Energy under the provisions of 42 U.S.C. 2182), Molten salt lithium cells.
    상세보기
  22. Raistrick Ian D. (Menlo Park CA) Poris Jaime (Portola Valley CA) Huggins Robert A. (Stanford CA), Molten salt lithium cells.
    상세보기
  23. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Multi-station semiconductor processor with volatilization.
    상세보기
  24. Ishida Hirofumi (Hiratsuka JPX), Plating device for wafer.
    상세보기
  25. Ishida Hirofumi (Kanagawa JPX), Plating device for wafer.
    상세보기
  26. Poris Jaime (Los Gatos CA), Precision weighing to monitor the thickness and uniformity of deposited or etched thin film.
    상세보기
  27. Aigo Seiichiro (3-15-13 ; Negishi ; Daito-ku Tokyo JPX), Process for washing and drying a semiconductor element.
    상세보기
  28. Gronet Christian M. (Palo Alto CA) Gibbons James F. (Palo Alto CA), Rapid thermal heating apparatus and method.
    상세보기
  29. Cuthbert John D. (Bethlehem PA) Soos Nicholas A. (Lower Macungie Township ; Lehigh County PA), Removal of coating from periphery of a semiconductor wafer.
    상세보기
  30. Poris Jaime (409 Capitola Ave. Capitola CA 95010), Selective metal electrodeposition process.
    상세보기
  31. Poris Jaime (21955 Bear Creek Way Los Gatos CA 95030), Selective metal electrodeposition process and apparatus.
    상세보기
  32. Allen Landon K. (Sunnyvale CA), Selective removal of coating material on a coated substrate.
    상세보기
  33. Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Single wafer processor.
    상세보기
  34. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor with a frame.
    상세보기
  35. Sato ; Masamichi ; Fujii ; Itsuo, Spin coating process.
    상세보기
  36. Leibovitz Jacques (San Jose CA) Cobarruviaz Maria L. (Cupertino CA) Scholz Kenneth D. (Palo Alto CA) Chao Clinton C. (Redwood City CA), Stacked solid via formation in integrated circuit systems.
    상세보기
  37. Leibovitz Jacques (San Jose CA) Cobarruviaz Maria L. (Cupertino CA) Scholz Kenneth D. (Palo Alto CA) Chao Clinton C. (Redwood City CA), Stacked solid via formation in integrated circuit systems.
    상세보기
  38. Hayashida Ichiro (Kawagoe JPX) Kakizawa Masahiko (Kawagoe JPX) Umekita Kenichi (Kawagoe JPX) Nawa Hiroyoshi (Kawagoe JPX) Muraoka Hisashi (Yokohama JPX), Surface treating cleaning method.
    상세보기
  39. Tuchida Junichi (Kanagawa JPX) Takamatsu Toshiyuki (Chiba JPX), Surface treatment method and apparatus for a semiconductor wafer.
    상세보기
  40. Powell Walter W. (Peculiar MO) Seifert Gary A. (Lee\s Summit MO), Vacuum-type article holder and methods of supportively retaining articles.
    상세보기
  41. Andricacos Panayotis C. (Croton-on-Hudson NY) Berridge Kirk G. (Fishkill NY) Dukovic John O. (Pleasantville NY) Flotta Matteo (Yorktown Heights NY) Ordonez Jose (Pleasant Valley NY) Poweleit Helmut R, Vertical paddle plating cell.
    상세보기

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  1. Herchen, Harald, Anode isolation by diffusion differentials.
    상세보기
  2. Yang, Michael X.; Kovarsky, Nicolay Y., Anolyte for copper plating.
    상세보기
  3. Yang,Michael X.; Kovarsky,Nicolay Y., Anolyte for copper plating.
    상세보기
  4. Klocke,John L.; Hanson,Kyle M., Apparatus and method for deposition of an electrophoretic emulsion.
    상세보기
  5. Klocke,John L.; Hanson,Kyle M., Apparatus and method for deposition of an electrophoretic emulsion.
    상세보기
  6. Klocke,John; Hanson,Kyle, Apparatus and method for deposition of an electrophoretic emulsion.
    상세보기
  7. Emami, Ramin, Apparatus and method for edge bead removal.
    상세보기
  8. Ganesan, Kousik; Ghongadi, Shanthinath; Majid, Tariq; Labrie, Aaron; Mayer, Steven T., Apparatus and method for edge bevel removal of copper from silicon wafers.
    상세보기
  9. Ganesan, Kousik; Ghongadi, Shantinath; Majid, Tariq; Labrie, Aaron; Mayer, Steven T., Apparatus and method for edge bevel removal of copper from silicon wafers.
    상세보기
  10. Lubomirsky, Dmitry; Stevens, Joseph J., Apparatus and method for rinsing substrates.
    상세보기
  11. Lubomirsky,Dmitry; Shanmugasundram,Arulkumar; Pancham,Ian A.; Lopatin,Sergey, Apparatus for electroless deposition.
    상세보기
  12. Lubomirsky, Dmitry; Shanmugasundram, Arulkumar; Ellwanger, Russell; Pancham, Ian A.; Cheboli, Ramakrishna; Weidman, Timothy W., Apparatus for electroless deposition of metals onto semiconductor substrates.
    상세보기
  13. Lubomirsky, Dmitry; Shanmugasundram, Arulkumar; Pancham, Ian A., Apparatus for electroless deposition of metals onto semiconductor substrates.
    상세보기
  14. Lubomirsky,Dmitry; Shanmugasundram,Arulkumar; Ellwanger,Russell; Pancham,Ian A.; Cheboli,Ramakrishna, Apparatus for electroless deposition of metals onto semiconductor substrates.
    상세보기
  15. Hongo, Akihisa; Matsuda, Naoki; Ohno, Kanji; Kimizuka, Ryoichi, Apparatus for forming interconnects.
    상세보기
  16. Basol,Bulent M.; Uzoh,Cyprian E., Apparatus for reduction of defects in wet processed layers.
    상세보기
  17. Ivanov, Igor C., Barrier layer configurations and methods for processing microelectronic topographies having barrier layers.
    상세보기
  18. Emami, Ramin, Capillary ring.
    상세보기
  19. Maydan, Dan, Coated anode apparatus and associated method.
    상세보기
  20. Tran,Daniel, Compact pinlifter assembly integrated in wafer chuck.
    상세보기
  21. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
    상세보기
  22. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
    상세보기
  23. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
    상세보기
  24. Nagai, Mizuki; Okuyama, Shuichi; Kimizuka, Ryoichi; Kobayashi, Takeshi, Copper-plating liquid, plating method and plating apparatus.
    상세보기
  25. Pedersen, John M.; Willey, Jeremy; Woodruff, Daniel J., Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces.
    상세보기
  26. Kistler, Rodney C., Electrochemical assisted CMP.
    상세보기
  27. Chandrasekhar, Prasanna; Zay, Brian J.; Modes, Sr., Richard; LaRosa, Anthony; Hobin, Kyle, Electrochemical deposition apparatus and methods of using the same.
    상세보기
  28. Yang,Michael X.; Lubomirsky,Dmitry; Dordi,Yezdi; Singh,Saravjeet; Tulshibagwale,Sheshraj; Kovarsky,Nicolay, Electrochemical processing cell.
    상세보기
  29. Chandrasekhar, Prasanna; Zay, Brian J.; Laganis, Edward J.; Romanov, Vasily V.; LaRosa, Anthony J., Electrochromic eyewear.
    상세보기
  30. Stevens,Joseph J.; Lubomirsky,Dmitry; Pancham,Ian; Olgado,Donald J. K.; Grunes,Howard E.; Mok,Yeuk Fai Edwin, Electroless deposition apparatus.
    상세보기
  31. Hongo, Akihisa; Mishima, Koji; Inoue, Hiroaki; Kimura, Norio; Karimata, Tsutomu, Electroless plating apparatus and method.
    상세보기
  32. Stevens, Joseph J.; Lubomirsky, Dmitry; Pancham, Ian; Olgado, Donald J.; Grunes, Howard E.; Mok, Yeuk-Fai Edwin; Dixit, Girish, Electroless plating system.
    상세보기
  33. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating reactor.
    상세보기
  34. Siebert,S철nke; Schweiger,Michael; Lang,Andreas, Holding device for disk-shaped objects.
    상세보기
  35. Wang,Xinming; Takagi,Daisuke; Tashiro,Akihiko; Fukunaga,Yukio; Fukunaga,Akira, Interconnects forming method and interconnects forming apparatus.
    상세보기
  36. Wang,Xinming; Takagi,Daisuke; Tashiro,Akihiko; Fukunaga,Yukio; Fukunaga,Akira, Interconnects forming method and interconnects forming apparatus.
    상세보기
  37. Feng, Jingbin; LaBrie, Aaron; Ganesan, Kousik, Magnetically actuated chuck for edge bevel removal.
    상세보기
  38. Aschke, Lutz; Renno, Markus; Schiffler, Mario; Sobel, Frank; Becker, Hans, Mask blank for use in EUV lithography and method for its production.
    상세보기
  39. Chen,B. Michelle; Shin,Ho Seon; Dordi,Yezdi; Morad,Ratson; Cheung,Robin, Method and apparatus for annealing copper films.
    상세보기
  40. Kazuhiko Gommori JP; Kazuto Kinoshita JP; Isamu Akiba JP; Masao Sugiyama JP, Method and apparatus for drying substrate plates.
    상세보기
  41. Morad, Ratson; Shin, Ho Seon; Cheung, Robin; Kogan, Igor, Method and apparatus for heating and cooling substrates.
    상세보기
  42. Sendai, Satoshi; Hongo, Akihisa; Tomioka, Kenya; Tsuda, Katsumi; Kumekawa, Masayuki; Ogure, Naoaki; Sasabe, Kenichi, Method and apparatus for plating substrate and plating facility.
    상세보기
  43. Hey, Peter; Kwak, Byung-Sung Leo, Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio.
    상세보기
  44. Shimokawa, Kimihiro; Murase, Kuniaki; Kitada, Atsushi; Kasuno, Takahito, Method for manufacturing electrolytic copper.
    상세보기
  45. Basol,Bulent M.; Uzoh,Cyprian E., Method for reduction of defects in wet processed layers.
    상세보기
  46. Zheng, Bo; Bajaj, Rajeev; Wang, Zhonghui Alex, Method for regulating the electrical power applied to a substrate during an immersion process.
    상세보기
  47. Ivanov, Igor C.; Zhang, Weiguo; Kolics, Artur, Method for strengthening adhesion between dielectric layers formed adjacent to metal layers.
    상세보기
  48. Ivanov, Igor C.; Zhang, Weiguo; Kolics, Artur, Method for strengthening adhesion between dielectric layers formed adjacent to metal layers.
    상세보기
  49. Zheng, Bo; Wang, Hougong; Dixit, Girish; Chen, Fusen, Method of application of electrical biasing to enhance metal deposition.
    상세보기
  50. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Methods and apparatus for processing the surface of a microelectronic workpiece.
    상세보기
  51. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Methods and apparatus for processing the surface of a microelectronic workpiece.
    상세보기
  52. Ivanov, Igor C.; Zhang, Weiguo, Methods and system for processing a microelectronic topography.
    상세보기
  53. Ivanov, Igor C.; Zhang, Weiguo, Methods and systems for processing a microelectronic topography.
    상세보기
  54. Ivanov,Igor C.; Zhang,Weiguo, Methods and systems for processing a microelectronic topography.
    상세보기
  55. Ivanov, Igor C.; Zhang, Weiguo, Microelectronic fabrication system components and method for processing a wafer using such components.
    상세보기
  56. Hanson, Kyle M.; Koziol, Jurek K.; Pedersen, John M.; Zmaj, Michal A., Microelectronic workpiece holders and contact assemblies for use therewith.
    상세보기
  57. Chen, Guan-Shian; Yang, Michael X., Modular electrochemical processing system.
    상세보기
  58. Britcher, Eric B.; Rabinovich, Yevgeniy; Sherman, Svetlana; Ohtani, Masami, Multi-channel developer system.
    상세보기
  59. Yang,Michael X.; Xi,Ming; Ellwanger,Russell C.; Britcher,Eric B.; Donoso,Bernardo; Pang,Lily L.; Sherman,Svetlana; Ho,Henry; Nguyen,Anh N.; Lerner,Alexander N.; D'Ambra,Allen L.; Shanmugasundram,Arul, Multi-chemistry plating system.
    상세보기
  60. Akram,Salman; Hembree,David R., Plating.
    상세보기
  61. Mizohata, Yasuhiro; Yane, Takeshi, Plating apparatus and plating method.
    상세보기
  62. Mizohata,Yasuhiro; Matsubara,Hideaki; Miyagi,Masahiro; Hayama,Ryuichi, Plating apparatus, plating cup and cathode ring.
    상세보기
  63. Chandrasekhar, Prasanna; Chai, Yanjie, Potentiostat/galvanostat with digital interface.
    상세보기
  64. De Ridder, Christianus Gerardus Maria; den Hartog, Edwin, Processing system with increased cassette storage capacity.
    상세보기
  65. Hongo, Akihisa; Katakabe, Ichiro; Morisawa, Shinya, Revolution member supporting apparatus and semiconductor substrate processing apparatus.
    상세보기
  66. Shelnut, James G.; Merricks, David; Dutkewych, Oleh B.; Shipley, Charles R., Seed layer deposition.
    상세보기
  67. Patton, Evan E.; Cacouris, Theodore; Broadbent, Eliot; Mayer, Steven T., Sequential station tool for wet processing of semiconductor wafers.
    상세보기
  68. Patton, Evan E.; Cacouris, Theodore; Broadbent, Eliot; Mayer, Steven T., Sequential station tool for wet processing of semiconductor wafers.
    상세보기
  69. Patton, Evan E.; Cacouris, Theodore; Broadbent, Eliot; Mayer, Steven T., Sequential station tool for wet processing of semiconductor wafers.
    상세보기
  70. Patton,Evan E.; Cacouris,Theodore; Broadbent,Eliot; Mayer,Steven T., Sequential station tool for wet processing of semiconductor wafers.
    상세보기
  71. Thompson, Raymon F.; Davis, Jeffry A.; Harris, Randy; Scranton, Dana R.; Pfeifle, Ryan; Peace, Steven A.; Aegerter, Brian, Single workpiece processing system.
    상세보기
  72. Ivanov, Igor; Ting, Chiu; Zhang, Jonathan Weiguo; Kolics, Arthur, Spatially-arranged chemical processing station.
    상세보기
  73. Dobashi, Kazuya; Inai, Kensuke; Shimizu, Akitaka; Yasuda, Kenta; Yoshino, Yu; Aida, Toshihiro; Senoo, Takehiko, Substrate cleaning apparatus and vacuum processing system.
    상세보기
  74. Aggarwal, Ravinder; Stoutjesdijk, Jeroen, Substrate handling chamber with movable substrate carrier loading platform.
    상세보기
  75. Goodman, Daniel; Keigler, Arthur; Guarnaccia, David G., Substrate holder.
    상세보기
  76. Donald J. K. Olgado ; Jayant Lakshmikanthan, Substrate holder system with substrate extension apparatus and associated method.
    상세보기
  77. Hongo,Akihisa; Ogure,Naoaki; Inoue,Hiroaki; Sendai,Satoshi; Ikegami,Tetsuma; Mishima,Koji; Okuyama,Shuichi; Nagai,Mizuki; Kimizuka,Ryoichi; Maruyama,Megumi, Substrate plating method and apparatus.
    상세보기
  78. Mishima, Koji; Kunisawa, Junji; Makino, Natsuki; Kimura, Norio; Inoue, Hiroaki; Nakamura, Kenji; Matsumoto, Moriji; Nanjo, Takahiro; Odagaki, Mitsuko, Substrate processing apparatus and substrate plating apparatus.
    상세보기
  79. Mishima,Koji; Kunisawa,Junji; Makino,Natsuki; Kimura,Norio; Inoue,Hiroaki; Nakamura,Kenji; Matsumoto,Moriji; Nanjo,Takahiro; Odagaki,Mitsuko, Substrate processing apparatus and substrate plating apparatus.
    상세보기
  80. Ivanov, Igor C., Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes.
    상세보기
  81. Ivanov, Igor C., Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes.
    상세보기
  82. Mok,Yeuk Fai Edwin; Nguyen,Son T., Two position anneal chamber.
    상세보기
  83. Ivanov, Igor C.; Zhang, Jonathan Weiguo, Universal substrate holder for treating objects in fluids.
    상세보기
  84. Chandrasekhar, Prasanna, Variable-emittance electrochromic devices and methods of preparing the same.
    상세보기
  85. Stephens, Craig P.; Kanetomi, Matt; Richardson, Joseph; Veazey, Chris; LaBrie, Aaron, Wafer chuck with aerodynamic design for turbulence reduction.
    상세보기
  86. Lin, Yu-Hsun, Wafer treatment solution for edge-bead removal, edge film hump reduction and resist surface smooth, its apparatus and edge-bead removal method by using the same.
    상세보기
  87. McNurlin, Randy; Maggio, Mark; Smigel, Michael; Wilkey, Ann; Farmer, James L.; Robertson, Shawn, Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector.
    상세보기
  88. McNurlin, Randy; Maggio, Mark; Smigel, Michael; Wilkey, Ann; Farmer, James L.; Robertson, Shawn, Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector.
    상세보기

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