초록 ▼

A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the se

A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of assembling a peripheral device printed circuit board package having first and second electrically conductive covers made of a first metallic material, and first and second electrically conductive frames made of a second metallic material, each of the first a

[ What is claimed is:] [1.]1. A method of assembling a peripheral device printed circuit board package having first and second electrically conductive covers made of a first metallic material, and first and second electrically conductive frames made of a second metallic material, each of the first and second electrically conductive covers having a perimeter, the method comprising the steps of:placing the second metallic material into a molding machine;converting the second metallic material to a thixotropic state;transferring a first amount of the second metallic material in the thixotropic state to a first mold where the first amount of the second metallic material flows around a portion of the perimeter of the first electrically conductive cover so as to form the first electrically conductive frame attached to the perimeter of the first electrically conductive cover, where the first electrically conductive cover is electrically connected to the first electrically conductive frame;transferring a second amount of the second metallic material in the thixotropic state to a second mold where the second amount of the second metallic material flows around a portion of the perimeter of the second electrically conductive cover so as to form the second electrically conductive frame attached to the perimeter of the second electrically conductive cover, where the second electrically conductive cover is electrically connected to the second electrically conductive frame; andbonding the first electrically conductive frame to the second electrically conductive frame, where the first electrically conductive frame is electrically connected to the second electrically conductive frame, and wherein, when the first frame is bonded to the second frame, the first and second covers do not physically contact each other.