초록 ▼

A centrifugal spray processor for dispensing a stream of ozonated water toward one or more semiconductor wafers at a non-parallel angle that is inclined from the plane of the surface of the semiconductor wafer. The spray processor includes one or more supports for receiving a plurality of semiconduc

A centrifugal spray processor for dispensing a stream of ozonated water toward one or more semiconductor wafers at a non-parallel angle that is inclined from the plane of the surface of the semiconductor wafer. The spray processor includes one or more supports for receiving a plurality of semiconductor wafers and a spray post for dispensing ozonated water from a reservoir onto the semiconductor wafers. The spray post includes a plurality of nozzles that are configured to dispense ozonated water at a generally downward angle toward the surface of the semiconductor wafer. The angle of incidence of the stream of ozonated water from the spray post as measured from the plane of the semiconductor is greater than 0 degrees, and is preferably greater than about 0 degrees and less than or equal to about 30 degrees depending upon the configuration of the spray post and the semiconductor wafers.

대표청구항 ▼

[ What is claimed is:] [16.]16. A method for dispensing ozonated water toward a substrate surface for processing the substrate surface, the method comprising the steps of:providing a substrate having a surface to be processed that exists in a plane; andcausing a stream of ozonated water to be direct

[ What is claimed is:] [16.]16. A method for dispensing ozonated water toward a substrate surface for processing the substrate surface, the method comprising the steps of:providing a substrate having a surface to be processed that exists in a plane; andcausing a stream of ozonated water to be directed toward the surface at an angle that is inclined from the plane containing the surface, the stream of ozonated water impacting the surface at the angle to process the surface of the substrate.