[특허]Thermoelectric semiconductor material, manufacture process therefor, and method of hot forging thermoelectric module using the same

Thermoelectric semiconductor material, manufacture process therefor, and method of hot forging thermoelectric module using the same 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-035/34
출원번호	US-0254657 (1999-03-15)
우선권정보	JP0243811 (1996-09-13)
국제출원번호	PCT/JP97/03263 (1997-09-16)
§371/§102 date	19990315 (19990315)
국제공개번호	WO-9811612 (1998-03-19)
발명자 / 주소	Fukuda Katsushi,JPX Sato Yasunori,JPX Kajihara Takeshi,JPX
출원인 / 주소	Komatsu Ltd., JPX
대리인 / 주소	Varndell & Varndell, PLLC
인용정보	피인용 횟수 : 29 인용 특허 : 3

초록 ▼

A thermoelectric semiconductor material having sufficient strength and performance and high production yield. The thermoelectric semiconductor material is characterized in that a sintered powder material of a thermoelectric semiconductor having a rhombohedral structure (or hexagonal structure) is hot-forged and plastically deformed to direct either the crystals of the sintered powder structure or the subcrystals constructing the crystals in a crystal orientation having an excellent figure of merit.

대표청구항 ▼

[ What is claimed is:] [14.]14. A method of manufacturing a thermoelectric semiconductor material comprising:a heating step in which material powder is mixed so as to have a desired composition, and melted by heating;a solidification step, in which a solid solution ingot of thermoelectric semiconductor material having a rhombohedral structure is formed;a crushing step in which the solid solution ingot is crushed to form a solid solution powder;a screening step in which the grain size of the solid solution powder is made uniform;a sintering step in which the solid solution powder whose grain size has been made uniform is subjected to pressing and sintering; anda hot upset forging step in which the powder sintered body is subjected to plastic deformation while hot, and extended, so that crystal grains or subcrystal grains constituting the crystal grains of the powder sintered structure are aligned in a crystal orientation of excellent figure of merit for providing a thermoelectric material of satisfactory strength and performance; anda further heat treatment step in which heat treatment is performed after the hot upset forging step.

이 특허에 인용된 특허 (3)

Karagoz Sadi (Yildiz-Istanbul TRX) Hribernik Bruno (Bruck an der Mur ATX) Stamberger Johann (Kapfenberg ATX) Puber Josef (Wimpassing ATX) Jeglitsch Franz (Leoben ATX) Fischmeister Hellmut (Stuttgart , High speed tool steel produced by powder metallurgy.
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McLeod Keith C. (Iona Station CAX), Method for producing a machinable, high strength hot formed powdered ferrous base metal alloy.
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Tokiai Takeo (Sodegaura JPX) Uesugi Takashi (Tokyo JPX) Fukumoto Kazuyuki (Sodegaura JPX) Ohta Toshitaka (Tsukuba JPX) Kajikawa Takenobu (Tsukuba JPX), Processes for producing a thermoelectric material and a thermoelectric element.
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이 특허를 인용한 특허 (29)

Moczygemba, Joshua E., Build-in-place method of manufacturing thermoelectric modules.
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Srinivasan, Raghavan; Spowart, Jonathan E.; Gothard, Nicholas, Control of crystallographic texture and grain size in bulk thermoelectric materials through constrained deformation.
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Hu, Chuan; Chau, David S., Densely packed thermoelectric cooler.
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Donald J. Hayes, Low cost method for making thermoelectric coolers.
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Chen, Zhiming; Gu, Wei, Method for manufacturing N-type semiconductor element for cooling or heating device.
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Ren, Zhifeng; Poudel, Bed; Chen, Gang; Lan, Yucheng; Wang, Dezhi; Hao, Qing; Dresselhaus, Mildred; Ma, Yi; Yan, Xiao; Chen, Xiaoyuan; Wang, Xiaowei; Giri, Joshi R.; Yu, Bo, Methods for high figure-of-merit in nanostructured thermoelectric materials.
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Chen, Gang; Dresselhaus, Mildred; Ren, Zhifeng, Nanocomposites with high thermoelectric figures of merit.
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Chen, Gang; Dresselhaus, Mildred; Ren, Zhifeng, Nanocomposites with high thermoelectric figures of merit.
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Chen,Gang; Ren,Zhifeng; Dresselhaus,Mildred, Nanocomposites with high thermoelectric figures of merit.
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Dutta, Biprodas, Nanowire electronic devices and method for producing the same.
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Dutta, Biprodas, Nanowire electronic devices and method for producing the same.
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Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
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Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
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Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
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Kanatzidis, Mercouri G.; Androulakis, John; Sootsman, Joseph R., Thermoelectric compositions and process.
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Yamashita, Osamu, Thermoelectric conversion material, method for manufacturing same, and thermoelectric conversion element.
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Sharp, Jeffrey W.; Bierschenk, James L.; Moczygemba, Joshua E., Thermoelectric device having P-type and N-type materials.
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Jovovic, Vladimir; Kossakovski, Dmitri; Heian, Ellen M., Thermoelectric devices with interface materials and methods of manufacturing the same.
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Jovovic, Vladimir; Kossakovski, Dmitri; Heian, Ellen M., Thermoelectric devices with interface materials and methods of manufacturing the same.
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Horio,Yuma; Suzuki,Junya, Thermoelectric material having crystal grains well oriented in certain direction and process for producing the same.
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Hayashi, Takahiro; Horio, Yuma; Hoshi, Toshiharu, Thermoelectric material improved in figure of merit, process for producing thereof and peltier module using the same.
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Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generating systems utilizing segmented thermoelectric elements.
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Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generator for variable thermal power source.
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Ota, Toshinori; Yoshizawa, Hiroki; Fujita, Kouiti; Imai, Isao; Tosho, Tsuyoshi; Nishiike, Ujihiro, Thermoelectric semiconductor material, thermoelectric semiconductor element using thermoelectric semiconductor material, thermoelectric module using thermoelectric semiconductor element and manufacturing method for same.
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Ota, Toshinori; Yoshizawa, Hirold; Fujita, Kouiti; Imai, Isao; Tosho, Tsuyoshi; Nishiike, Ujihiro, Thermoelectric semiconductor material, thermoelectric semiconductor element using thermoelectric semiconductor material, thermoelectric module using thermoelectric semiconductor element and manufacturing method for same.
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Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
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Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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Thermoelectric semiconductor material, manufacture process therefor, and method of hot forging thermoelectric module using the same 원문보기