초록 ▼

An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circu

An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

대표청구항 ▼

[ What is claimed is:] [1.]1. An interposer for making connections to electrical contacts on a surface of a microelectronic element, the interposer comprising:(a) a body having a first major surface, said body having horizontal directions parallel to said first major surface defining a horizontal pl

[ What is claimed is:] [1.]1. An interposer for making connections to electrical contacts on a surface of a microelectronic element, the interposer comprising:(a) a body having a first major surface, said body having horizontal directions parallel to said first major surface defining a horizontal plane;(b) a plurality of conductors extending into said body; and(c) a plurality of contacts at said first major surface, each said contact being permanently joined to one said conductor at a juncture and extending radially outwardly away from said juncture, each said contact having a periphery remote from said conductor and overlying said first major surface of said body, each said contact being adapted to deform so that the periphery of the contact will expand radially outwardly overlying said first major surface of said body away from said juncture between the contact and the conductor in response to a vertical force toward said body applied to said contact, whereby said contacts will wipe the pads of a microelectronic element when the microelectronic element is juxtaposed with said first surface and forced toward said body.