초록 ▼

A method of fabricating a micro-mechanical sensor (101) comprising the steps for forming an insulating layer (6) onto the surface of a first wafer (4) bonding a second wafer (2) to the insulating layer (6), patterning and subsequently etching either the first (4) or second wafer (6) such that channe

A method of fabricating a micro-mechanical sensor (101) comprising the steps for forming an insulating layer (6) onto the surface of a first wafer (4) bonding a second wafer (2) to the insulating layer (6), patterning and subsequently etching either the first (4) or second wafer (6) such that channels (18, 20) are created in either the first (2) or second (4) wafer terminating adjacent the insulating layer (6) and etching the insulating layer (6) to remove portions of the insulating layer (6) below the etched wafer such that those portions of the etched wafer below a predetermined cross section, suspended portions (22), become substantially freely suspended above the un-etched wafer. This method uses Silicon on Insulator technology. Also disclosed is a micro-mechanical gyroscope structure (101) allowing an anisotropic silicon to be used to fabricate a sensor functioning as if fabricated from isotropic silicon.

대표청구항 ▼

[ What is claimed is:] [1.]1. A micro-mechanical ring gyroscope having a ring element which is fabricated from a material having anisotropic properties, the dimensions of at least a portion of the element being thicker or thinner when compared to the remainder of the element so that said gyroscope f

[ What is claimed is:] [1.]1. A micro-mechanical ring gyroscope having a ring element which is fabricated from a material having anisotropic properties, the dimensions of at least a portion of the element being thicker or thinner when compared to the remainder of the element so that said gyroscope functions as if it were manufactured from a material having isotropic properties.