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Fiber optic reflectance apparatus for in situ characterization of thin films 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/75
출원번호 US-0086768 (1998-05-29)
발명자 / 주소
  • Johnson Edward A.
  • Morse Theodore F.
출원인 / 주소
  • Brown University Research Foundation
대리인 / 주소
    McDermott, Will & Emery
인용정보 피인용 횟수 : 35  인용 특허 : 23

초록

A fiber optic reflectometer employs an optical fiber near a target substrate in a deposition chamber. The optical fiber is positioned within the chamber so that deposition of a thin film on the substrate also occurs on a portion of the optical fiber. A combination of monochromatic and broadband whit

대표청구항

[ What is claimed is:] [1.]1. A system for in situ characterization of thin films deposited on a substrate, comprising:a) a deposition chamber, including input means for introducing one or more process reactants into the chamber, output means for exhausting by-products from the chamber, and means fo

이 특허에 인용된 특허 (23)

  1. Kikkawa Toshihide (Kawasaki JPX) Tanaka Hitoshi (Kawasaki JPX) Ochimizu Hirosato (Kawasaki JPX), Apparatus for generating raw material gas used in apparatus for growing thin film.
  2. Takeuchi Masayuki,JPX ; Nakagawa Shinya,JPX, Apparatus for monitoring in-situ the thickness of a film during film deposition and a method thereof.
  3. Hartley Richard H. (Seaview Downs AUX), Control of uniformity of growing alloy film.
  4. Hartley Richard H. (Seaview Downs AUX), Control of uniformity of growing alloy film.
  5. Southwell William H. (Thousand Oaks CA) Hall Randolph L. (Newbury Park CA), Deposition of multiple layer thin films using a broadband spectral monitor.
  6. Eckstein James N. (Cupertino CA) Webb Christopher (Los Altos CA) Weng Shang-Lin (Cupertino CA), Growth rate monitor for molecular beam epitaxy.
  7. Shiokawa Akira (Osaka JPX) Yasui Hideaki (Osaka JPX) Kotera Koichi (Osaka JPX) Mukai Yuuji (Osaka JPX) Tanaka Hiroyoshi (Kyoto JPX) Hirao Takashi (Osaka JPX), In-process film thickness monitoring system.
  8. Gifford George G. (Bethel CT) O\Neill James A. (New City NY), Infrared thermographic method and apparatus for etch process monitoring and control.
  9. Page Jerry L. (Kentwood MI), Interface configuration for rate sensor apparatus.
  10. Ehrlich Daniel J. (Lexington MA) Arnone Claudio (Palermo MA ITX) Rothschild Mordecai (Newton MA), Method and apparatus for photodeposition of films on surfaces.
  11. Massoud Hisham Z. (Durham NC) Sampson Ronald K. (Durham NC), Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid.
  12. Kawai Hiroji (Kanagawa) Imanaga Syunji (Kanagawa) Hase Ichiro (Tokyo) Kaneko Kunio (Kanagawa) Watanabe Naozo (Tokyo JPX), Method and apparatus for vapor deposition.
  13. Yu Chorng-Tao (Yorba Linda CA) Isaak Kenneth H. (Tustin CA), Method for film thickness endpoint control.
  14. Fogle Ozzie (Orangeburg SC) Back Harry E. (Orangeburg SC), Method for measuring film thickness on wood panels using an IR analyzer.
  15. Ohta Yutaka (Annaka JPX) Katayama Masatake (Takasaki JPX) Moroga Isao (Annaka JPX), Method of making a SOI film having a more uniform thickness in a SOI substrate.
  16. Patel Chandra K. N. (Summit NJ) Tam Andrew C. (Sunnyvale CA), Optoacoustic spectroscopy of thin layers.
  17. Schantz Christopher A. (Redwood City CA), Pyrolysis coated optical fiber splices: apparatus and method.
  18. Southwell William H. (Thousand Oaks CA) Norton Kirkpatrick W. (San Diego CA), Refractive index monitor for deposition of gradient-index films.
  19. Kawada Hiroki (Ishioka JPX) Takahashi Kazue (Kudamatsu JPX) Edamura Manabu (Ibaraki-ken JPX) Kanai Saburo (Hikari JPX) Tamura Naoyuki (Kudamatsu JPX), Semiconductor device manufacturing apparatus and method with optical monitoring of state of processing chamber.
  20. Schafer ; Jr. Kenneth L. (Box 1 ; 63 Greene St. New York NY 10012), Sensor and method for the in situ monitoring and control of microstructure during rapid metal forming processes.
  21. Stefani Jerry A. (Richardson TX) Butler Stephanie W. (Plano TX), System and method for monitoring and evaluating semiconductor wafer fabrication.
  22. Kamerling Marc A. (Santa Rosa CA) Beauchamp William T. (Santa Rosa CA) Klinger Robert E. (Rohnert Park CA) Lehan John P. (Calistoga CA), Thin film coating and method.
  23. Bevis Christopher F. (San Francisco CA) Neukermans Armand P. (Palo Alto CA) Stokowski Stanley E. (Danville CA) Wolf Ralph C. (Palo Alto CA) Lutzker Matthew B. (Atherton CA), Thin film thickness monitor.

이 특허를 인용한 특허 (35)

  1. Price, Joseph K., Anodizing system with a coating thickness monitor and an anodized product.
  2. Price,Joseph K., Anodizing system with a coating thickness monitor and an anodized product.
  3. Price,Joseph K., Anodizing system with a coating thickness monitor and an anodized product.
  4. Johs,Blaine D.; Tiwald,Thomas E., Ellipsometric investigation of thin films.
  5. Johs,Blaine D., Ellipsometric investigation of very thin films.
  6. Nimmakayala, Pawan Kumar; Choi, Byung-Jin; Rafferty, Tom H.; Schumaker, Philip D., Enhanced multi channel alignment.
  7. Voisin, Ronald D., Imprint alignment method, system and template.
  8. Voisin, Ronald D., Imprint alignment method, system, and template.
  9. Nimmakayala, Pawan Kumar; Rafferty, Tom H.; Aghili, Alireza; Choi, Byung-Jin; Schumaker, Philip D.; Babbs, Daniel A.; Truskett, Van Nguyen, Interferometric analysis method for the manufacture of nano-scale devices.
  10. Oluseyi, Hakeem; Sarfaty, Moshe, Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system.
  11. Du-Nour, Ofer; Ish-Shalom, Yaron, Method and apparatus for measuring stress in semiconductor wafers.
  12. Chiu,Wilson K. S.; Kwok,King Hong, Method and apparatus for open-air coating by laser-induced chemical vapor deposition.
  13. Harvey, Kenneth C., Method and apparatus for reducing the effects of window clouding on a viewport window in a reactive environment.
  14. Price, Joseph K., Method for forming and measuring the thickness of an anodized coating.
  15. Scherer, Karin; Lacan, Pascale; Bosmans, Richard, Method for treating antireflection coatings on an optical substrate, the thus obtained optical substrate and device for carrying gout said method.
  16. Johs, Blaine D.; Hale, Jeffrey S., Method of determining substrate etch depth.
  17. Sreenivasan, Sidlgata V.; Watts, Michael P. C., Method to arrange features on a substrate to replicate features having minimal dimensional variability.
  18. Choi, Byung J.; Colburn, Matthew; Sreenivasan, S. V.; Willson, C. Grant; Bailey, Todd; Ekerdt, John, Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography.
  19. Moffatt, Stephen, Methods for photo-excitation of precursors in epitaxial processes using a rotary scanning unit.
  20. Oluseyi, Hakeem; Sarfaty, Moshe, Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy.
  21. Naughton, Michael J.; Kempa, Krzysztof J.; Ren, Zhifeng, Nanoscale optical microscope.
  22. Delahoy, Alan E., Non-contacting deposition control of chalcopyrite thin films.
  23. Atanasov, Georgi A., Optical monitoring of thin film deposition.
  24. Atanasov,Georgi A., Optical monitoring of thin films using fiber optics.
  25. Rahman, Anisur; Eze, Reginald; Kumar, Sunil, Optical sensor for measuring thin film disposition in real time.
  26. Gee, James M.; Lin, Shawn-Yu; Fleming, James G.; Moreno, James B., Photonically engineered incandescent emitter.
  27. Baker, Daniel C., Photoresist dispense arrangement by compensation for substrate reflectivity.
  28. Shajii,Ali; Nagarkatti,Siddharth P., Semiconductor manufacturing gas flow divider system and method.
  29. Johs, Blaine D., Spectroscopic ellipsometry analysis of object coatings during deposition.
  30. Price,Joseph K., System capable of determining applied and anodized coating thickness of a coated-anodized product.
  31. Takahashi, Yukihiro; Shinde, Kenichi, Thin film forming method and apparatus.
  32. Yukihiro Takahashi JP; Kenichi Shinde JP, Thin film forming method and apparatus.
  33. Anderson, Charles; Blieske, Ulf, Transparent substrate comprising an antireflection coating.
  34. Anderson, Charles; Blieske, Ulf, Transparent substrate comprising an antireflection coating.
  35. Sopori,Bhushan L., Wafer characteristics via reflectometry and wafer processing apparatus and method.
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