초록 ▼

An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the p

An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for determining an endpoint associated with chemical mechanical polishing a metal layer on a substrate, the endpoint having a predetermined intensity pattern, the method comprising:bringing a surface of the substrate into contact with a polishing pad that has a

[ What is claimed is:] [1.]1. A method for determining an endpoint associated with chemical mechanical polishing a metal layer on a substrate, the endpoint having a predetermined intensity pattern, the method comprising:bringing a surface of the substrate into contact with a polishing pad that has a window;causing relative motion between the substrate and the polishing pad;directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate;detecting light beam reflections from the metal layer as the light beam moves in the path across the substrate;generating a plurality of reflection measurements from the detected light beam reflections, the plurality of reflection measurements corresponding to a plurality of locations of the light beam along the path;calculating a radial position on the substrate for at least some of the reflection measurements;sorting the reflection measurements into a plurality of radial ranges based on the radial position associated with each reflection measurement; andidentifying the predetermined pattern from the reflection measurements in the plurality of radial ranges to establish the endpoint.