초록 ▼

A compliant bond structure 20 comprising wire mesh 25 strands 50 surrounded by compliant metal 40 is useful for bonding a ceramic surface 30 to a metal surface 35. The wire mesh 25 comprises interlocking strands 50 having longitudinal axes that are oriented substantially parallel to the ceramic and

A compliant bond structure 20 comprising wire mesh 25 strands 50 surrounded by compliant metal 40 is useful for bonding a ceramic surface 30 to a metal surface 35. The wire mesh 25 comprises interlocking strands 50 having longitudinal axes that are oriented substantially parallel to the ceramic and metal surfaces 30, 35. More preferably, the wire mesh 25 comprises strands having a coefficient of thermal expansion that is about 0.4 to about 1.6 times the average of the coefficients of thermal expansion of the metal and ceramic surfaces 30, 35.

대표청구항 ▼

[ What is claimed is:] [1.]1. A support assembly capable of supporting a substrate in a process chamber, the support assembly comprising:(a) an electrostatic chuck comprising a ceramic having an electrode therein, the electrostatic chuck having an upper surface capable of receiving the substrate and

[ What is claimed is:] [1.]1. A support assembly capable of supporting a substrate in a process chamber, the support assembly comprising:(a) an electrostatic chuck comprising a ceramic having an electrode therein, the electrostatic chuck having an upper surface capable of receiving the substrate and a lower surface;(b) a support having a support surface capable of supporting the lower surface of the electrostatic chuck; and(c) a bond between the lower surface and the support surface, the bond comprising a wire mesh.