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Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0545996 (2000-04-10)
우선권정보 TW8105757 (1999-04-12)
발명자 / 주소
  • Lo Randy H. Y.,TWX
  • Lai Jeng Yuan,TWX
  • Ko Eric,TWX
  • Ho Tzong-Da,TWX
출원인 / 주소
  • Siliconware Precision Industries, Co., Ltd., TWX
대리인 / 주소
    Corless
인용정보 피인용 횟수 : 99  인용 특허 : 13

초록

A BGA (Ball-Grid Array) IC package with an unembedded type of heat-dissipation structure is proposed. The unembedded type of heat-dissipation structure is characterized in that a plurality of thermally-conductive vias are formed in the substrate and extending from the die-attachment area to the back

대표청구항

[ What is claimed is:] [1.]1. A BGA IC package with an unembedded type of heat-dissipation structure, which comprises:a substrate having a front surface and a back surface, with the front surface having a central part being defined as a die-attachment area;an IC chip mounted on the die-attachment ar

이 특허에 인용된 특허 (13)

  1. Selna Erich, Ball grid array package for an integrated circuit.
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  11. Pastore John R. (Leander TX) Nomi Victor K. (Round Rock TX) Wilson Howard P. (Austin TX), Pad array semiconductor device with thermal conductor and process for making the same.
  12. Higashiguchi Yutaka,JPX ; Inagaki Mitsuo,JPX ; Kumai Toshio,JPX ; Ochiai Ryoichi,JPX ; Totani Makoto,JPX, Semiconductor device having terminals for heat radiation.
  13. Oh Sang Eon,KRX, Solder ball grid array carrier package with heat sink.

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