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Thermoelectric cooling apparatus and method for maximizing energy transport 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
출원번호 US-0458271 (1999-12-09)
발명자 / 주소
  • Ghoshal Uttam Shyamalindu
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Yee
인용정보 피인용 횟수 : 97  인용 특허 : 6

초록 ▼

Apparatus and method for sub-ambient cooling using thermoelectric dynamics in conjunction with novel configuration schemes to maximize energy transport to thereby increase the efficiency of thermoelectric cooling. In one form, a junction maximizes energy transport being positioned between and couple

대표청구항 ▼

[ What is claimed is:] [1.]1. A thermoelectric cooling apparatus comprising:a first thermoelectric element;a second thermoelectric element; anda junction positioned between and coupled to said first and second thermoelectric elements wherein said junction conducts electrical current between said fir

이 특허에 인용된 특허 (6)

  1. Tomatsu Yoshitaka (Nagoya JPX) Yamada Kenji (Chiryu JPX) Oike Tatsuya (Okazaki JPX) Nishizawa Kazutoshi (Toyoake JPX) Itou Satoshi (Kariya JPX), Dehumidifying apparatus with electronic refrigeration unit.
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  2. Tauchi Hitoshi,JPX, Multistage thermoelectric cooling device.
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  3. Ghamaty Saeid ; Elsner Norbert B., Quantum well thermoelectric material on organic substrate.
    상세보기
  4. Ghoshal Uttam Shyamalindu, Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms.
    상세보기
  5. Ghoshal Uttam Shyamalindu, Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms.
    상세보기
  6. Ghoshal Uttam Shyamalindu, Two dimensional thermoelectric cooler configuration.
    상세보기

이 특허를 인용한 특허 (97)

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  7. Gawthrop, Peter R., Climate control method for hybrid vehicles using thermoelectric devices.
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  45. Brykalski, Michael; Marquette, David, Moisture abatement in heating operation of climate controlled systems.
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  54. Bell, Lon E.; LaGrandeur, John, System and method for climate control within a passenger compartment of a vehicle.
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  55. Bell, Lon E.; LaGrandeur, John, System and method for distributed thermoelectric heating and cooling.
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  56. Ghoshal,Uttam, System employing temporal integration of thermoelectric action.
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  62. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities.
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  63. Siivola, Edward P.; Mahadevan, Ramaswamy, Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces.
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  64. Kanatzidis, Mercouri G.; Androulakis, John; Sootsman, Joseph R., Thermoelectric compositions and process.
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  67. Riel, Heike E.; Schmidt, Volker, Thermoelectric device.
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  68. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Thermoelectric device controls and methods.
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  69. Goenka, Lakhi Nandlal, Thermoelectric device efficiency enhancement using dynamic feedback.
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  70. Goenka, Lakhi Nandlal, Thermoelectric device efficiency enhancement using dynamic feedback.
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  71. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian, Thermoelectric device with internal sensor.
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  93. Venkatasubramanian,Rama, Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags.
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