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Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-005/12
  • B44C-001/22
출원번호 US-0994184 (1997-12-19)
발명자 / 주소
  • Bishop Craig V.
  • Bokisa George S.
  • Durante Robert J.
  • Kochilla John R.
출원인 / 주소
  • Atotech Deutschland GmbH, DEX
대리인 / 주소
    Renner, Otto, Boisselle & Sklar, LLP
인용정보 피인용 횟수 : 22  인용 특허 : 23

초록 ▼

This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper co

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of producing a substrate which includes preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent,

이 특허에 인용된 특허 (23)

  1. Bokisa George S. (North Olmsted OH) Willis William J. (North Royalton OH), Aqueous electroless plating solutions.
    상세보기
  2. Bokisa George S. ; Willis William J., Aqueous immersion plating bath and method for plating.
    상세보기
  3. Dueber Thomas Eugene (Wilmington DE) Schadt ; III Frank Leonard (Wilmington DE), Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits.
    상세보기
  4. Nishimura Shigefumi (Yawata JPX) Fukuda Masao (Takatsuki JPX) Shimizu Yoshiji (Higashiosaka JPX), Bath for immersion plating tin-lead alloys.
    상세보기
  5. Dodd John R. (Wilmington) Arduengo ; III Anthony J. (Wilmington) King Randal D. (Wilmington DE) Vitale Americus C. (West Chester PA), Complexing agent for displacement tin plating.
    상세보기
  6. Yokono Hitoshi (Toride JPX) Yokono Haruki (Yono JPX) Mikamo Masahiro (Shimodate JPX) Narushima Ryouichi (Shimodate JPX) Iida Takuya (Yuuki JPX) Endo Yasuhiro (Shimodate JPX), Copper clad laminate, multilayer printed circuit board and their processing method.
    상세보기
  7. Plueddemann Edwin P. (Midland MI), Coupling agent compositions.
    상세보기
  8. Wilson Harold P. (Huron OH), Electrodeposited eutectic tin-bismuth alloy on a conductive substrate.
    상세보기
  9. Melton Cynthia M. (Bolingbrook IL) Growney Alicia (Barrington IL) Fuerhaupter Harry (Lombard IL), Immersion plating of tin-bismuth solder.
    상세보기
  10. Nobel Fred I. (Sands Point NY) Ostrow Barnet D. (Roslyn NY) Schram David N. (Freeport NY), Limiting tin sludge formation in tin or tin/lead electroplating solutions.
    상세보기
  11. Krulik Gerald A. (Hoffman Estates IL), Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a.
    상세보기
  12. Davis Charles Robert (Wappingers Falls NY) Gall Thomas P. (Lancester NY), Method for producing multi-layer circuit board and resulting article of manufacture.
    상세보기
  13. Beach Sidney C. (Parma OH) Frisby C. Richard (Strongsville OH), Method of copper plating gravure cylinders.
    상세보기
  14. Engelhaupt Darell E. (St. Cloud FL), Method of forming electrodeposited anti-reflective surface coatings.
    상세보기
  15. Poutasse Charles A. (Beachwood OH) Luthy Richard L. (Beverly OH), Multi-layer structures containing a silane adhesion promoting layer.
    상세보기
  16. Palladino John V. (Paulsboro NJ), Multilayer printed circuit board formation.
    상세보기
  17. Opaskar Vince (Cleveland Hts. OH) Canaris Valerie (Parma OH) Willis William J. (North Royalton OH), Plating bath and method for electroplating tin and/or lead.
    상세보기
  18. Nakaso Akishi (Oyama JPX) Okamura Toshiro (Shimodate JPX) Ogino Haruo (Shimodate JPX) Watanabe Tomoko (Ibaraki JPX) Kimura Yuko (Shimodate JPX), Process for treating copper surface.
    상세보기
  19. King Randal D. (Wilmington DE) Vitale Americus C. (West Chester PA), Stabilized spray displacement plating process.
    상세보기
  20. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin and tin alloys as a bonding medium for multilayer circuits.
    상세보기
  21. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin and tin alloys as a bonding medium for multilayer circuits.
    상세보기
  22. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin coating as etch resist.
    상세보기
  23. Abbott Charles N. (Dayton OH), Zinc-copper alloy electroplating baths.
    상세보기

이 특허를 인용한 특허 (22)

  1. Owei, Abayomi I.; Nguyen, Hiep X.; Yakobson, Eric, Adhesion promotion in printed circuit boards.
    상세보기
  2. Owei, Abayomi I.; Nguyen, Hiep X.; Yakobson, Eric, Adhesion promotion in printed circuit boards.
    상세보기
  3. Owei, Abayomi I.; Nguyen, Hiep X.; Yakobson, Eric, Adhesion promotion in printed circuit boards.
    상세보기
  4. Owei,Abayomi I.; Nguyen,Hiep X.; Yakobson,Eric, Adhesion promotion in printed circuit boards.
    상세보기
  5. Lützow, Norbert; Schmidt, Gabriela; Tews, Dirk, Aqueous composition for etching of copper and copper alloys.
    상세보기
  6. Klein, Klausjorg; Kohhirt, Walter, Cathodic electrodeposition coatings, their production and their use.
    상세보기
  7. Yap,Yoon Foong; Chee,Moses Moh Shu, Chemical leadframe roughening process and resulting leadframe and integrated circuit package.
    상세보기
  8. Yano, Ayako; Fukunaga, Atsushi; Kawakami, Atsushi; Ogawa, Akira, Curable composition and cured product thereof.
    상세보기
  9. Li, Felix C.; Lee, Yee Kim; Lim, Peng Soon; Yii, Terh Kuen; Lee, Lee Han Meng@Eugene, Delamination resistant device package having low moisture sensitivity.
    상세보기
  10. Li, Felix C.; Lee, Yee Kim; Lim, Peng Soon; Yii, Terh Kuen; Lee, Lee Han Meng@Eugene, Delamination resistant device package having raised bond surface and mold locking aperture.
    상세보기
  11. Imori,Toru; Sekiguchi,Junnosuke; Yabe,Atsushi, Electroless plating method and semiconductor wafer on which metal plating layer is formed.
    상세보기
  12. Wang,Xingwu; Greenwald,Howard J.; Miller,Ronald E.; Helfer,Jeffrey L.; Gray,Robert, Magnetically shielded assembly.
    상세보기
  13. Wang,Xingwu; Greenwald,Howard J.; Miller,Ronald E.; Helfer,Jeffrey L.; Gray,Robert, Magnetically shielded assembly.
    상세보기
  14. Riedl,Edmund; Schober,Wolfgang, Metal article intended for at least partially coating with a substance and a method for producing the same.
    상세보기
  15. Riedl, Edmund; Schober, Wolfgang, Method for producing a metal article intended for at least partially coating with a substance.
    상세보기
  16. Bernards,Roger; Gonzalez,Hector; Kucera,Al; Schanhaar,Mike, Method for roughening copper surfaces for bonding to substrates.
    상세보기
  17. Bernards,Roger; Gonzalez,Hector; Kucera,Al; Schanhaar,Mike, Method for roughening copper surfaces for bonding to substrates.
    상세보기
  18. Cole, Joseph; Sedlak, Rudolf P., Methods and compositions for oxide production on copper.
    상세보기
  19. Leung, Mei Kiu; Lai, Willetta; Cheng, Pit Kai Peter; Wong, Cecilia Po Sze, PWB manufacture.
    상세보기
  20. Zhang, Jun Qing, Primer composition.
    상세보기
  21. Francesco Tomaiuolo IT; Riccardo Ottria IT, Process for promoting adhesion between an inorganic substrate and an organic polymer.
    상세보기
  22. Lee, Yee Kim; Lim, Peng Soon; Yii, Terh Kuen; Lee, Lee Han Meng@Eugene, TO263 device package having low moisture sensitivity.
    상세보기

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