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Composite materials and methods for manufacturing composite materials 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-015/00
  • B32B-015/20
출원번호 US-0303196 (1999-04-30)
발명자 / 주소
  • Jones Herman L.
  • Taylor Edward A.
출원인 / 주소
  • Pacific Aerospace & Electronics, Inc.
대리인 / 주소
    Speckman
인용정보 피인용 횟수 : 20  인용 특허 : 20

초록

Composite materials are composed of a primary metallic base material, such as a titanium metallic material, metallurgically bonded to one or more secondary materials having desirable thermal conductivity properties and having a coefficient of thermal expansion ("CTE") that generally matches the CTE

대표청구항

[ We claim:] [1.]1. A composite material comprising:a primary metallic base material forming a primary metallic structure having one or more recesses, wherein the primary metallic base material has a first thermal conductivity and a first coefficient of thermal expansion (CTE);a secondary material d

이 특허에 인용된 특허 (20)

  1. Erler William F. ; O'Hagan Timothy P. ; Grzelak Keith D., Active cooling system for cradle of portable electronic devices.
  2. Nicetto Romeo (Senago ITX), Centrifugal casting machine.
  3. Karmarkar Subhash D. (Great Falls VA) Divecha Amarnath P. (Falls Church VA), Centrifugal casting of composites.
  4. Noordegraaf Jan (At Arnhem NLX) Alsem Wilfred H. H. (At Arnhem NLX) Groenenberg Cornelis J. R. (At Arnhem NLX) Rensen Cornelis (At Arnhem NLX), Centrifugal casting of metal matrix composites.
  5. Taylor Edward A. (Roseburg OR), Dissimilar metal connectors.
  6. Polese Frank J. ; Ocheretyansky Vladimir, Heat-dissipating package for microcircuit devices.
  7. Polese Frank J. ; Ocheretyansky Vladimir, Heat-dissipating package for microcircuit devices and process for manufacture.
  8. Polese Frank J., Heat-dissipating substrate for micro-electronic devices and fabrication method.
  9. Knoell Albert C. (La Crescenta CA) Loftin Timothy A. (Semi Valley CA), Hybrid metal matrix composite chassis structure for electronic circuits.
  10. Premkumar M. K. ; Sawtell Ralph R. ; Phelps Frankie E. ; DerKacy James A. ; Yun David I., Incorporating partially sintered preforms in metal matrix composites.
  11. Sawtell Ralph R. (Monroeville PA) Premkumar Mosur K. (Monroeville PA) Yun David I. (Murrysville PA), Metal matrix composites containing electrical insulators.
  12. Polese Frank J. (4421 Granger St. San Diego CA 92126) Giniel Walter V. (San Marcos CA) Hermes Terrence V. (San Diego CA) Ocheretyansky Vladimir (Santee CA), Method for making heat-dissipating elements for micro-electronic devices.
  13. Newkirk Marc S. (Newark DE) White Danny R. (Elkton MD) Kennedy Christopher R. (Newark DE) Nagelberg Alan S. (Wilmington DE) Aghajanian Michael K. (Bel Air MD) Wiener Robert J. (Newark DE) Keck Steven, Method of forming electronic packages.
  14. Newkirk Marc S. (Newark DE) White Danny R. (Elkton MD) Kennedy Christopher R. (Newark DE) Nagelberg Alan S. (Wilmington DE) Aghajanian Michael K. (Bel Air MD) Wiener Robert J. (Newark DE), Methods for forming macrocomposite bodies and macrocomposite bodies produced thereby.
  15. Keck Steven D. (Hockessin DE) Rocazella Michael A. (Newark DE) Engelgau Peter M. (Dover DE) Hannon Gregory E. (Newark DE) White Danny R. (Elkton MD) Nagelberg Alan S. (Wilmington DE), Methods of forming electronic packages.
  16. Yun David I. ; Sawtell Ralph R. ; Hunt Warren H. ; Baumgartner H. Robert ; Streicher Eric T. ; Ehman Michael F., Monolithic metal matrix composite.
  17. Kuroda Toshio (Nagoya JPX) Kumazawa Koichi (Nagoya JPX), Package comprising a composite metal body brought into contact with a ceramic member.
  18. Taylor Edward A. (Roseburg OR), Sealable electronics packages.
  19. Taylor Edward A. (Roseburg OR), Sealable electronics packages and methods of producing and sealing such packages.
  20. Morimoto Hiroyuki,JPX ; Ouchi Kenichiro,JPX ; Iwamura Hiroshi,JPX, SiC-reinforced aluminum alloy composite material.

이 특허를 인용한 특허 (20)

  1. Bewlay, Bernard Patrick; Weimer, Michael James; Bancheri, Stephen Francis; McKiever, Joan; Ellis, Brian Michael, Calcium hexaluminate-containing mold and facecoat compositions and methods for casting titanium and titanium aluminide alloys.
  2. Bewlay, Bernard Patrick; McKiever, Joan; Ellis, Brian Michael; McLasky, Nicholas Vincent, Calcium titanate containing mold compositions and methods for casting titanium and titanium aluminide alloys.
  3. Bewlay, Bernard Patrick; Bancheri, Stephen Francis; McKiever, Joan; Ellis, Brian Michael, Crucible and extrinsic facecoat compositions.
  4. Bewlay, Bernard Patrick; Bancheri, Stephen Francis; McKiever, Joan; Ellis, Brian Michael, Crucible and extrinsic facecoat compositions and methods for melting titanium and titanium aluminide alloys.
  5. Bewlay, Bernard Patrick; Bancheri, Stephen; McKiever, Joan; Ellis, Brian; Giddings, Robert A., Crucible and facecoat compositions.
  6. Fisk, Andrew E.; Fu, Richard X.; Frysz, Christine A., Functionally graded coatings for lead wires in medical implantable hermetic feedthrough assemblies.
  7. Taylor, Edward Allen, Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components.
  8. Reeves, Matthew A.; Holland, Robert Scott; Loong, Sy-Jenq, Method of producing a liquid cooled coldplate.
  9. Loong, Sy-Jenq; Smith, Donald Lynn, Method of producing an enhanced base plate.
  10. Tanaka,Katsufumi; Kinoshita,Kyoichi; Sugiyama,Tomohei; Kono,Eiji, Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate.
  11. Loong, Sy-Jenq; Smith, Donald Lynn, Method of producing electronics substrate with enhanced direct bonded metal.
  12. Brandes, Donald J.; Beavers, James L., Methods and apparatus for assembling strong, lightweight thermal panel and insulated building structure.
  13. Esposito, Gerard A., Methods and apparatus for sealed fiber optic feedthroughs.
  14. Bewlay, Bernard Patrick; Bancheri, Stephen; Weimer, Michael; McKiever, Joan; Ellis, Brian, Methods for casting titanium and titanium aluminide alloys.
  15. Bewlay, Bernard Patrick; Bancheri, Stephen; Weimer, Michael; McKiever, Joan; Ellis, Brian, Mold and facecoat compositions.
  16. Bewlay, Bernard Patrick, Mold compositions.
  17. Kinoshita, Kyoichi; Tanaka, Katsufumi; Kono, Eiji, Radiator plate and process for manufacturing the same.
  18. Bewlay, Bernard Patrick; McKiever, Joan; Ellis, Brian Michael; McClasky, Nicholas Vincent, Silicon carbide-containing mold and facecoat compositions and methods for casting titanium and titanium aluminide alloys.
  19. Bewlay, Bernard Patrick; McKiever, Joan; Ellis, Brian Michael; McLasky, Nicholas Vincent, Silicon carbide-containing mold and facecoat compositions and methods for casting titanium and titanium aluminide alloys.
  20. Bewlay, Bernard Patrick; Janssen, Jonathan Sebastian; Wei, Bin; Zhou, Youdong, Titanium aluminide article with improved surface finish.
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