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Method and apparatus for high-pressure wafer processing and drying

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-005/04
출원번호 US-0481651 (2000-01-12)
발명자 / 주소
  • Bergman Eric J.
  • Sharp Ian
  • Meuchel Craig P.
  • Woods H. Frederick
출원인 / 주소
  • Semitool, Inc.
대리인 / 주소
    Lyon & Lyon LLP
인용정보 피인용 횟수 : 101  인용 특허 : 8

초록

A method and apparatus for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel,pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a

대표청구항

[ What is claimed is:] [1.]1. A method for drying a semiconductor wafer, comprising the steps of:placing the wafer into a vessel;delivering a liquid into the vessel, creating a liquid level;sealing the vessel so that it is pressure-tight;delivering a pressurized gas into the vessel;draining the liqu

이 특허에 인용된 특허 (8)

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이 특허를 인용한 특허 (101)

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