초록 ▼

The present invention provides heat dissipation systems for use in hinged computing devices which includes a thermally conductive joint (36). The joint has first and second receptacles (104, 108) which are generally parallel to and adjacent one another. A first heat pipe (22) is at least partially d

The present invention provides heat dissipation systems for use in hinged computing devices which includes a thermally conductive joint (36). The joint has first and second receptacles (104, 108) which are generally parallel to and adjacent one another. A first heat pipe (22) is at least partially disposed within the first receptacle and is adapted to be thermally coupled to a heat source within the hinged computing device. A second heat pipe (30) is at least partially disposed within the second receptacle and is adapted to be thermally coupled to a heat sink. The thermally conductive joint permits the transfer of heat from the first heat pipe to the second heat pipe to transfer heat from the heat source to the heat sink portion of the hinged computing device.

대표청구항 ▼

[ What is claimed is:] [1.]1. A hinged computer, comprising:a base comprising a processor and a first heat pipe, said first heat pipe and said processor being thermally coupled;a lid assembly hingedly connected to said base, said lid assembly comprising a second heat pipe and a display;a thermally c

[ What is claimed is:] [1.]1. A hinged computer, comprising:a base comprising a processor and a first heat pipe, said first heat pipe and said processor being thermally coupled;a lid assembly hingedly connected to said base, said lid assembly comprising a second heat pipe and a display;a thermally conductive joint, said joint having first and second receptacles, said first receptacle being generally parallel to and adjacent said second receptacle;wherein an end of said first heat pipe is positioned within said first receptacle and an end of said second heat pipe is positioned within said second receptacle to thermally couple said ends and said joint; andwherein at least a portion of said display is proximate said second heat pipe, said second heat pipe configured to transfer at least some heat from said processor to said display to facilitate operation of said display.