초록 ▼

A method and apparatus for processing wafer edges is disclosed. Pressure applied to the wafer at one end of A brush/pad assembly is greater than at the opposite end of the brush/pad assembly. The increased pressure causes wafer rotation to slow or to reverse direction as compared to less pressure ap

A method and apparatus for processing wafer edges is disclosed. Pressure applied to the wafer at one end of A brush/pad assembly is greater than at the opposite end of the brush/pad assembly. The increased pressure causes wafer rotation to slow or to reverse direction as compared to less pressure applied by the brush/pad assembly. In one embodiment slowed rotation causes a difference in tangential velocity between the roller(s) and the wafer edge/bevel that causes pads in the roller(s) to process the edge/bevel of the wafer. In another embodiment, the opposite direction of rotation causes the wafer to rotate counter to rollers otherwise causing the wafer to rotate. Cleaning surfaces in the rollers clean the edges of the wafer whether rotation is slowed or reversed.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of processing a wafer, the method comprising:supporting a wafer to be processed;applying a processing element across a first surface of the wafer, the processing element having a first end and a second end and being configured to rotate;applying a first pressur

[ What is claimed is:] [1.]1. A method of processing a wafer, the method comprising:supporting a wafer to be processed;applying a processing element across a first surface of the wafer, the processing element having a first end and a second end and being configured to rotate;applying a first pressure to the first end of the rotating processing element; andapplying a second pressure to the second end of the rotating processing element, wherein the first and second pressures are not equal and thereby apply the rotating processing element across the wafer with non-uniform pressure.