초록 ▼

This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material,

This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

대표청구항 ▼

[ What is claimed is:] [1.]1. A process for applying a metal structure to a workpiece comprising:providing a first electroplating bath including copper sulfate as a source of metal ions as a principal metal species to be deposited during subsequent electroplating, ammonium sulfate, a complexing agen

[ What is claimed is:] [1.]1. A process for applying a metal structure to a workpiece comprising:providing a first electroplating bath including copper sulfate as a source of metal ions as a principal metal species to be deposited during subsequent electroplating, ammonium sulfate, a complexing agent, and ethylene glycol;providing a workpiece on which one or more microelectronic devices are to be formed;exposing at least one surface of the workpiece to the first electroplating bath;providing electroplating power between the at least one surface of the workpiece and an anode disposed in electrical contact with the first electroplating bath to electroplate copper onto the at least one surface of the workpiece in an electrolytic first deposition process; anddepositing additional copper onto the copper deposited in the first deposition process using a second deposition process that is different than the first electrolytic deposition process.