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A crack-preventive substrate for fabricating a solder mask in a device site region includes a substrate, which has a top surface and a bottom surface, and a solder mask layer. The substrate is divided into a device site region and a periphery region. The solder mask layer, disposed on the top surfac

A crack-preventive substrate for fabricating a solder mask in a device site region includes a substrate, which has a top surface and a bottom surface, and a solder mask layer. The substrate is divided into a device site region and a periphery region. The solder mask layer, disposed on the top surface and bottom surface of the substrate, forms a bare area on the top surface and bottom surface of the substrate by exposing a portion of the substrate on the top surface and bottom surface of the substrate. And the bare areas divide the solder mask layer into a "device site region solder mask layer" and a "periphery region solder mask layer". As a result, the crack lines generated on the solder mask layer at the perimeter of the substrate will not develop toward the solder mask in the device site region.

대표청구항 ▼

[ What is claimed is:] [10.]10. A process for fabricating a semiconductor package, comprising:providing a substrate which has a top surface and a bottom surface, and the substrate also comprises a device site region and a periphery region wherein a slender slot is formed on the substrate on each sid

[ What is claimed is:] [10.]10. A process for fabricating a semiconductor package, comprising:providing a substrate which has a top surface and a bottom surface, and the substrate also comprises a device site region and a periphery region wherein a slender slot is formed on the substrate on each side of the device site region leaving the four corners thereof for connecting the device site region and the periphery region;forming a solder mask layer on the top surface and bottom surface of the substrate to expose external connections on the top surface and the bottom surface, wherein bare areas which are not covered with the solder mask are formed at the corners of the top surface and bottom surface of the substrate, respectively;mounting a die in the device site region on the top surface of the substrate;performing an encapsulating process in the device site region on the top surface of the substrate;performing a solder-ball planting process; andperforming a singulating process to separate the device site region and the periphery region.