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Microfabricated structures with electrical isolation and interconnections 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/06
출원번호 US-0322381 (1999-05-28)
발명자 / 주소
  • Clark William A.
  • Juneau Thor N.
  • Roessig Allen W.
  • Lemkin Mark A.
출원인 / 주소
  • Analog Devices IMI, Inc.
대리인 / 주소
    Vierra Magen Marcus Harmon & DeNiro LLP
인용정보 피인용 횟수 : 81  인용 특허 : 31

초록

The performance of microelectromechanical devices is improved by 1) having a high-aspect-ratio between vertical and lateral dimensions of the mechanical elements, 2) integrating electronics on the same substrate as the mechanical elements, 3) good electrical isolation among mechanical elements and c

대표청구항

[ What is claimed is:] [1.]1. A microelectromechanical device, comprising:a substrate having a semiconductor device layer;a first trench formed in said device layer, said first trench including a dielectric;a second trench formed in said device layer, said second trench simultaneously defining one o

이 특허에 인용된 특허 (31)

  1. Muenzel Horst,DEX ; Schubert Dietrich,DEX ; Boehringer Alexandra,DEX ; Offenberg Michael,DEX ; Heyers Klaus,DEX ; Lutz Markus,DEX, Acceleration sensor.
  2. Offenberg Michael (Tuebingen DEX), Acceleration sensor.
  3. Offenberg, Michael; Buchholtz, Wolfgang; Lutz, Markus, Acceleration sensor.
  4. Biebl Markus (Munich DEX) Scheiter Thomas (Munich DEX) Klose Helmut (Munich DEX), Acceleration sensor and method for manufacturing same.
  5. Offenberg Michael (Tuebingen DEX), Accelerometer sensor of crystalline material and method for manufacturing the same.
  6. Marek Jiri (Reutlingen DEX) Bantien Frank (Ditzingen DEX) Muenzel Horst (Reutlingen DEX) Offenberg Michael (Tuebingen DEX), Capacitive accelerometer sensor and method for its manufacture.
  7. Iida Makio (Ichinomiya JPX) Shibata Tadashi (Toyokawa JPX) Sugisaka Takayuki (Okazaki JPX) Miura Shoji (Nukata-gun JPX) Sakakibara Toshio (Nishio JPX), Dielectric isolated type semiconductor device provided with bipolar element.
  8. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Electrically isolated released microstructures.
  9. Field Leslie A. ; Merchant Paul P., Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding.
  10. Spangler Leland J. (1974 Traver Rd. ; Apt. No. 208 Ann Arbor MI 48105) Wise Kensall D. (3670 Charter Pl. Ann Arbor MI 48105), Fully integrated single-crystal silicon-on-insulator process, sensors and circuits.
  11. Diem Bernard (Echirolles FRX) Michel France (Sassenage FRX), Integrated accelerometer with a sensitive axis parallel to the substrate.
  12. Oppermann Klaus-Guenter,DEX, Integrated circuit structure with interconnect formed along walls of silicon island.
  13. Fujii Tetsuo (Toyohashi JPX) Imai Masahito (Chita JPX), Mechanical force sensing semiconductor device.
  14. Tsang Robert W. K. (Bedford MA) Core Theresa A. (North Andover MA), Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure.
  15. Montague Stephen ; Smith James H. ; Sniegowski Jeffry J. ; McWhorter Paul J., Method for integrating microelectromechanical devices with electronic circuitry.
  16. Schwalke Udo (Heldenstein DEX), Method for manufacturing a trench in a substrate for use in smart-power technology.
  17. Zhang Z. Lisa (Ithaca NY) MacDonald Noel C. (Ithaca NY), Method of forming compound stage MEM actuator suspended for multidimensional motion.
  18. Baba Yoshiro (Yokohama JPX) Koshino Yutaka (Yokohama JPX) Osawa Akihiko (Tokyo JPX) Yanagiya Satoshi (Kawasaki JPX), Method of making complete dielectric isolation structure in semiconductor integrated circuit.
  19. Bashir Rashid ; Kabir Abul E., Method of making surface micro-machined accelerometer using silicon-on-insulator technology.
  20. Benz Gerhard (Boeblingen DEX) Marek Jiri (Reutlingen DEX) Bantien Frank (Ditzingen DEX) Muenzel Horst (Reutlingen DEX) Laermer Franz (Stuttgart DEX) Offenberg Michael (Tuebingen DEX) Schilp Andrea (S, Method of manufacturing sensor.
  21. Kung Joseph T. (Boston MA), Methods for planarization and encapsulation of micromechanical devices in semiconductor processes.
  22. Galvin Gregory J. ; Davis Timothy J. ; MacDonald Noel C., Microelectromechanical accelerometer for automotive applications.
  23. Clark William A. ; Juneau Thor ; Howe Roger T., Micromachined vibratory rate gyroscope.
  24. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Microstructures and single mask, single-crystal process for fabrication thereof.
  25. Sherman Steven J. ; Tsang Robert W. K. ; Core Theresa A. ; Brokaw A. Paul, Monolithic micromechanical apparatus with suspended microstructure.
  26. Muenzel Horst,DEX ; Schubert Dietrich,DEX ; Boehringer Alexandra,DEX ; Offenberg Michael,DEX ; Heyers Klaus,DEX ; Lutz Markus,DEX, Process for manufacturing a sensor.
  27. Diem Bernard (Chirolles FRX) Delaye Marie-Therese (Grenoble FRX), Process for the production of accelerometers using silicon on insulator technology.
  28. MacDonald Noel C. (Ithaca) Zhang Zuoying L. (Ithaca NY), RIE process for fabricating submicron, silicon electromechanical structures.
  29. Kurle Juergen,DEX ; Funk Karsten,DEX ; Laermer Franz,DEX ; Offenberg Michael,DEX ; Schilp Andrea,DEX, Sensor and method for manufacturing a sensor.
  30. Sulzberger Peter (Treuchtlingen DEX) Offenberg Michael (Tuebingen DEX) Elsner Bernhard (Kornwestheim DEX) Lutz Markus (Reutlingen DEX), Sensor comprising multilayer substrate.
  31. Chong John M. ; MacDonald Noel C., Suspended moving channels and channel actuators for microfluidic applications and method for making.

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  9. Kar-Roy, Arjun; Racanelli, Marco; Zhang, Jinshu, Deep N wells in triple well structures.
  10. Denison, Timothy J.; Kelly, Thomas W., Differential parametric amplifier with physically-coupled electrically-isolated micromachined structures.
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  36. Liu, Xiaolei; Gutierrez, Roman C.; Leang, Pat K.; Mendez, Jose A.; Zaharia, Corneliu; Drimbarean, Alexandru F.; Bigioi, Petronel Gheorghe, MEMS-based optical image stabilization.
  37. Liu, Xiaolei; Gutierrez, Roman C.; Leang, Pat K.; Mendez, Jose A.; Zaharia, Corneliu; Drimbarean, Alexandru F.; Bigioi, Petronel Gheorghe, MEMS-based optical image stabilization.
  38. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.
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  42. Sawyer,William D.; Borenstein,Jeffrey T., Method for microfabricating structures using silicon-on-insulator material.
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  71. Freywald, Karlheinz; Hoelzer, Gisbert, SOI disks comprising MEMS structures and filled isolating trenches having a defined cross-section.
  72. Sakai, Minekazu; Kato, Yoshiyuki; Murata, Minoru, Semiconductor dynamic quantity sensor with movable electrode and fixed electrode supported by support substrate.
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  77. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
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