초록 ▼

An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes the

An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.

대표청구항 ▼

[ What is claimed is:] [26.]26. A passively cooled repeater housing for a plurality of repeater modules for use in the outside plant of the local loop of a telecommunication transmission network, said repeater housing providing plug-in access to the repeater modules, said repeater housing comprising

[ What is claimed is:] [26.]26. A passively cooled repeater housing for a plurality of repeater modules for use in the outside plant of the local loop of a telecommunication transmission network, said repeater housing providing plug-in access to the repeater modules, said repeater housing comprising:an environmental enclosure having a removable cover and at least one sidewall; anda thermal chassis disposed within said environmental enclosure and in thermal contact with said at least one sidewall, said thermal chassis being adapted to removably accommodate said plurality of repeater modules, to collect waste heat generated by said plurality of repeater modules, and to conduct waste heat to said at least one sidewall;wherein said thermal chassis remains in thermal contact with said at least one sidewall upon removal of said cover.