초록 ▼

A system for facilitating wafer transfer comprises a susceptor unit consisting of an inner susceptor section which rests within an outer susceptor section. A vertically movable and rotatable support spider located beneath the susceptor unit can rotate into positions to engage either the inner or the

A system for facilitating wafer transfer comprises a susceptor unit consisting of an inner susceptor section which rests within an outer susceptor section. A vertically movable and rotatable support spider located beneath the susceptor unit can rotate into positions to engage either the inner or the outer susceptor sections. When the inner section is engaged, the support spider lifts the inner section vertically out of the outer section. When the outer section is engaged, the support spider raises and lowers the entire susceptor unit. A robotic arm end effector engaging only the lower surface of the outer edge of the wafer permits hot wafer pick-up and unloading by the inner susceptor section. Several end effectors are disclosed that minimize non-uniform thermal effect on the substrate.

대표청구항 ▼

[ What is claimed is:] [1.]1. An apparatus for supporting and handling a substrate in a substrate processing system, comprising:a forked end effector for transferring a thin, flat substrate to or from an inner section of a two-piece support unit, said end effector having a pair of spaced support arm

[ What is claimed is:] [1.]1. An apparatus for supporting and handling a substrate in a substrate processing system, comprising:a forked end effector for transferring a thin, flat substrate to or from an inner section of a two-piece support unit, said end effector having a pair of spaced support arms joined by a closed end portion and defining an open end, said arms being spaced sufficiently to straddle the inner section and permit relative vertical movement between the end effector and said inner section, said arms being spaced less than a maximum side-to-side dimension of said substrate so that relative vertical movement of the inner section and said tool will transfer the substrate between the inner section and the tool support arms, said tool being formed to engage the lower surface of the outer portion of said substrate.