초록 ▼

A method for manufacturing a diffusion barrier layer over a substrate having a patterned copper layer. A refractory metal layer or a nitride layer of refractor metal is formed on the substrate and a top surface and a sidewall of the patterned copper layer. The refractory metal layer or the nitride l

A method for manufacturing a diffusion barrier layer over a substrate having a patterned copper layer. A refractory metal layer or a nitride layer of refractor metal is formed on the substrate and a top surface and a sidewall of the patterned copper layer. The refractory metal layer or the nitride layer of refractor metal is converted by HDP treatment into an implanted layer as a diffusion barrier layer, where gas of N.sub.2, O.sub.2, NH.sub.3, NO.sub.2 ; or N.sub.2 O are used for producing implanting ions. A thermal process is performed stabilize a diffusion barrier quality of the oxygen-containing implantation layer.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for manufacturing a diffusion barrier layer over a substrate having a patterned copper layer, the method comprising the steps of:forming a refractory metal layer on the substrate and a top surface and a sidewall of the patterned copper layer;performing a high d

[ What is claimed is:] [1.]1. A method for manufacturing a diffusion barrier layer over a substrate having a patterned copper layer, the method comprising the steps of:forming a refractory metal layer on the substrate and a top surface and a sidewall of the patterned copper layer;performing a high density plasma (HDP) treatment to convert the refractory metal layer into an implantation layer which serves as a diffusion barrier layer; andperforming a thermal process to stabilize a diffusion barrier quality of the implantation layer.