$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Fabrication process for a semiconductor substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0807604 (1997-02-27)
우선권정보 JP0041709 (1996-02-28)
발명자 / 주소
  • Sakaguchi Kiyofumi,JPX
  • Yonehara Takao,JPX
출원인 / 주소
  • Canon Kabushiki Kaisha, JPX
대리인 / 주소
    Fitzpatrick, Cella, Harper & Scinto
인용정보 피인용 횟수 : 97  인용 특허 : 10

초록

Carried out to achieve the above are a step of bonding a principal surface of a first substrate to a principal surface of a second substrate, the first substrate being Si substrate in which at least one layer of non-porous thin film is formed through a porous Si layer, a step of exposing the porous

대표청구항

[ What is claimed is:] [1.]1. A fabrication process for a semiconductor film comprising:a step of preparing a first substrate having at least one layer of non-porous thin film on a porous Si layer;a step of forming a bonding substrate by bonding said first substrate to a second substrate such that s

이 특허에 인용된 특허 (10)

  1. Tayanaka Hiroshi,JPX, Method for making thin film semiconductor.
  2. Matsushita Takeshi,JPX ; Tayanaka Hiroshi,JPX, Method for separating a device-forming layer from a base body.
  3. Sato Nobuhiko,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX, Process for producing semiconductor substrate by heat treating.
  4. Sato Nobuhiko,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX, Process for producing semiconductor substrate by heating to flatten an unpolished surface.
  5. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX, Process for production of semiconductor substrate.
  6. Bruel Michel,FRX ; Poumeyrol Thierry,FRX, Process for the production of a structure having a thin semiconductor film on a substrate.
  7. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
  8. Yonehara Takao (Atsugi JPX) Yamagata Kenji (Kawasaki JPX), Process of making semiconductor-on-insulator substrate.
  9. Sakaguchi Kiyofumi (Atsugi JPX) Yonehara Takao (Atsugi JPX), Semiconductor device substrate and process for preparing the same.
  10. Yonehara Takao (Atsugi JPX), Semiconductor member and process for preparing semiconductor member.

이 특허를 인용한 특허 (97)

  1. Giannuzzi, Lucille A.; Stevie, Frederick A.; Vartuli, Catherine, Calibration method for quantitative elemental analysis.
  2. Ohmi, Kazuaki; Sakaguchi, Kiyofumi; Yanagita, Kazutaka, Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof.
  3. Henley, Francois J.; Cheung, Nathan W., Controlled cleaving process.
  4. Henley,Francois J.; Cheung,Nathan W., Controlled cleaving process.
  5. Henley, Francois J.; Cheung, Nathan, Controlled process and resulting device.
  6. Henley, Francois J.; Cheung, Nathan, Controlled process and resulting device.
  7. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  8. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  9. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  10. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  11. Aspar, Bernard; Moriceau, Hubert; Zussy, Marc; Rayssac, Olivier, Detachable substrate or detachable structure and method for the production thereof.
  12. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Display device including light-emitting layer.
  13. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Film and light-emitting device.
  14. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Flexible light-emitting device.
  15. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Flexible light-emitting device.
  16. Chida, Akihiro; Hatano, Kaoru; Nagata, Takaaki; Seo, Satoshi, Flexible light-emitting device, and method for fabricating the same.
  17. Joly, Jean-Pierre; Ulmer, Laurent; Parat, Guy, Integrated circuit on high performance chip.
  18. Henley, Francois J., Layer transfer of films utilizing controlled propagation.
  19. Henley, Francois J., Layer transfer of films utilizing controlled shear region.
  20. Yamazaki, Shunpei; Eguchi, Shingo, Light-emitting device and electronic device.
  21. Yamazaki, Shunpei; Eguchi, Shingo, Light-emitting device and electronic device.
  22. Yamazaki, Shunpei; Eguchi, Shingo, Light-emitting device and electronic device.
  23. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Light-emitting device and electronic device including substrate having flexibility.
  24. Seo, Satoshi; Hatano, Kaoru, Light-emitting device and electronic device using the same.
  25. Seo, Satoshi; Hatano, Kaoru, Light-emitting device and electronic device using the same.
  26. Hatano, Kaoru; Nagata, Takaaki; Sugisawa, Nozomu; Okano, Tatsuya; Chida, Akihiro; Inoue, Tatsunori, Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device.
  27. Hatano, Kaoru, Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device.
  28. Houston,Theodore W.; Joyner,Keith A., Means for forming SOI.
  29. Ohmi, Kazuaki; Yonehara, Takao; Sakaguchi, Kiyofumi; Yanagita, Kazutaka, Method and apparatus for separating composite member using fluid.
  30. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Method and apparatus for separating member.
  31. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Method and apparatus for separating member.
  32. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Method and apparatus for separating member.
  33. Henley, Francois J., Method and structure for fabricating solar cells using a thick layer transfer process.
  34. Jurczak, Malgorzata; Skotnicki, Thomas, Method for making a silicon substrate comprising a buried thin silicon oxide film.
  35. Jurczak, Malgorzata; Skotnicki, Thomas, Method for making a silicon substrate comprising a buried thin silicon oxide film.
  36. Fournel, Franck; Moriceau, Hubert; Lagahe, Christelle, Method for making a stressed structure designed to be dissociated.
  37. Deguet, Chrystel; Clavelier, Laurent, Method for making a thin-film element.
  38. Aga, Hiroji; Kobayashi, Norihiro, Method for manufacturing bonded SOI wafer.
  39. Tauzin, Aurélie; Dechamp, Jérôme; Mazen, Frédéric; Madeira, Florence, Method for preparing thin GaN layers by implantation and recycling of a starting substrate.
  40. Nguyen, Nguyet-Phuong; Cayrefourcq, Ian; Lagahe-Blanchard, Christelle; Bourdelle, Konstantin; Tauzin, Aurélie; Fournel, Franck, Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation.
  41. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  42. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  43. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  44. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  45. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  46. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  47. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  48. Yamazaki,Shunpei; Ohtani,Hisashi, Method of fabricating a semiconductor device.
  49. Yamazaki,Shunpei; Ohtani,Hisashi, Method of fabricating a semiconductor device.
  50. Yamazaki,Shunpei; Ohtani,Hisashi, Method of fabricating a semiconductor device.
  51. Huang, Chien-Chao; Yeo, Yee-Chia; Yang, Kuo-Nan; Lin, Chun-Chieh; Hu, Chenming, Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance.
  52. Huang,Chien Chao; Yeo,Yee Chia; Yang,Kuo Nan; Lin,Chun Chieh; Hu,Chenming, Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance.
  53. Schwarzenbach,Walter; Maleville,Christophe, Method of making cavities in a semiconductor wafer.
  54. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  55. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  56. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  57. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  58. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  59. Yamazaki, Shunpei, Method of manufacturing a semiconductor device having a gate electrode formed over a silicon oxide insulating layer.
  60. Yamazaki, Shunpei, Method of manufacturing a semiconductor device including thermal oxidation to form an insulating film.
  61. Yamazaki, Shunpei, Method of manufacturing semiconductor device having island-like single crystal semiconductor layer.
  62. Aspar, Bernard; Bruel, Michel; Poumeyrol, Thierry, Method of producing a thin layer of semiconductor material.
  63. Aspar, Bernard; Bruel, Michel; Poumeyrol, Thierry, Method of producing a thin layer of semiconductor material.
  64. Aspar,Bernard; Bruel,Michel; Poumeyrol,Thierry, Method of producing a thin layer of semiconductor material.
  65. Aspar,Bernard; Bruel,Michel; Poumeyrol,Thierry, Method of producing a thin layer of semiconductor material.
  66. Deguet, Chrystel; Clavelier, Laurent; Dechamp, Jerome, Method of transferring a thin film onto a support.
  67. Fournel, Franck, Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer.
  68. Bruel, Michel; Aspar, Bernard; Lagahe-Blanchard, Chrystelle, Methods of making substrate structures having a weakened intermediate layer.
  69. Yamazaki, Shunpei; Ohtani, Hisashi; Koyama, Jun; Fukunaga, Takeshi, Nonvolatile memory and electronic apparatus.
  70. Liu, Dongfang; Zhang, Wei; Chen, Xiaoyuan; Yang, Hui; Wang, Cong; Lu, Linfeng, Preparation method of crystalline silicon film based on layer transfer.
  71. Fukunaga, Takeshi, Process for production of SOI substrate and process for production of semiconductor device.
  72. Fukunaga, Takeshi, Process for production of SOI substrate and process for production of semiconductor device.
  73. Fukunaga, Takeshi, Process for production of SOI substrate and process for production of semiconductor device.
  74. Fukunaga,Takeshi, Process for production of SOI substrate and process for production of semiconductor device.
  75. Fukunaga, Takeshi, Process for production of SOI substrate and process for production of semiconductor device including the selective forming of porous layer.
  76. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film.
  77. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film comprising an inclusion creation step.
  78. Henley, Francois J.; Brailove, Adam, Race track configuration and method for wafering silicon solar substrates.
  79. Yanagita, Kazutaka; Yonehara, Takao; Omi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  80. Yanagita, Kazutaka; Yonehara, Takao; Omi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  81. Yamazaki, Shunpei, Semiconductor device.
  82. Maruyama, Junya; Takayama, Toru; Goto, Yuugo, Semiconductor device and method of manufacturing the same.
  83. Maruyama, Junya; Takayama, Toru; Goto, Yuugo, Semiconductor device and method of manufacturing the same.
  84. Maruyama, Junya; Takayama, Toru; Goto, Yuugo, Semiconductor device and method of manufacturing the same.
  85. Maruyama, Junya; Takayama, Toru; Goto, Yuugo, Semiconductor device and method of manufacturing the same.
  86. Yamazaki, Shunpei; Ohtani, Hisashi; Koyama, Jun; Fukunaga, Takeshi, Semiconductor device having buried oxide film.
  87. Sekiguchi,Yoshinobu; Yonehara,Takao; Koto,Makoto; Okuda,Masahiro; Shimada,Tetsuya, Semiconductor film manufacturing method and substrate manufacturing method.
  88. Yoshida, Yoshiko; Naruoka, Hideki; Kimura, Yasuhiro; Yamaguchi, Yasuo; Iwamatsu, Toshiaki; Hirano, Yuuichi, Semiconductor substrate processing method.
  89. Yoshida, Yoshiko; Naruoka, Hideki; Kimura, Yasuhiro; Yamaguchi, Yasuo; Iwamatsu, Toshiaki; Hirano, Yuuichi, Semiconductor substrate with stacked oxide and SOI layers with a molten or epitaxial layer formed on an edge of the stacked layers.
  90. Yamazaki, Shunpei; Koyama, Jun; Miyanaga, Akiharu; Fukunaga, Takeshi, Semiconductor thin film and method of manufacturing the same and semiconductor device and method of manufacturing the same.
  91. Moriceau, Hubert; Aspar, Bernard; Margail, Jacques, Stacked structure and production method thereof.
  92. Sakaguchi, Kiyofumi, Substrate and manufacturing method therefor.
  93. Sakaguchi, Kiyofumi, Substrate and manufacturing method therefor.
  94. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  95. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  96. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  97. Brailove, Adam; Liu, Zuqin; Henley, Francois J.; Lamm, Albert J., Techniques for forming thin films by implantation with reduced channeling.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로